Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.31 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.31 |
| ▸ | TBXAS1 | P24557 | 2/20 | 0.31 |
| ▸ | HTR2C | P28335 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | BLM | P54132 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4942897 | 0.87 | TBXAS1 (0.32) | DGKATBXAS1 | |
| SCHEMBL6131135 | 0.83 | NPC1 (0.38) | DGKATDP1ADRA2AADRA1ATBXAS1 | |
| SCHEMBL4178738 | 0.81 | DGKA (0.33) | DGKATDP1ADRA2AADRA1ATBXAS1 | |
| SCHEMBL4940438 | 0.81 | TBXAS1 (0.34) | DGKATBXAS1HTR2C | |
| SCHEMBL3404599 | 0.79 | DGKA (0.43) | DGKATBXAS1 | |
| SCHEMBL4323518 | 0.79 | TBXAS1 (0.33) | TBXAS1 | |
| SCHEMBL7622070 | 0.78 | DGKA (0.41) | DGKATDP1ADRA2AADRA1AHTR2C | |
| SCHEMBL10923708 | 0.77 | TSHR (0.33) | TBXAS1 | |
| SCHEMBL36408 | 0.76 | MGAM (0.39) | DGKATDP1ADRA2AADRA1ATBXAS1 | |
| SCHEMBL6363350 | 0.76 | TSHR (0.38) | TDP1TBXAS1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1862042-B1 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME | FUJIFILM CORP (JP) | 2013-04-10 | — | — | EP | disclosed |
| US-8273463-B2 | Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material | FUJIFILM CORPORATION (JP) | 2012-09-25 | — | — | US | disclosed |
| US-8187664-B2 | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same | FUJIFILM CORPORATION (JP) | 2012-05-29 | — | — | US | disclosed |
| CN-101120621-B | Method of forming metallic pattern, metallic pattern and printed wiring board using it and TFT wiring circuit | FUJI PHOTO FILM CO LTD | 2011-04-20 | — | — | CN | disclosed |
| US-7879535-B2 | A fine conductive metal pattern superior in heat resistance, adhesion property to a base surface and durability on a polyimide surface; simplification; grafting an acylic monomer on polyimide to interact with electroless plating catalyst; reduction of metal salt in defined pattern; printed circuit | FUJIFILM CORPORATION (JP) | 2011-02-01 | — | — | US | disclosed |
| US-20090269599-A1 | MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090092766-A1 | GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2009-04-09 | — | — | US | disclosed |
| US-20090022885-A1 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-01-22 | — | — | US | disclosed |
| US-7438950-B2 | Metallic pattern forming method and conductive pattern material | FUJIFILM CORPORATION (JP) | 2008-10-21 | — | — | US | disclosed |
| CN-101120621-A | Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit | FUJI FILM CORP (JP) | 2008-02-06 | — | — | CN | disclosed |
| EP-1862042-A1 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME | FUJIFILM Corporation (JP) | 2007-12-05 | — | — | EP | disclosed |
| WO-2006123834-A2 | GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2006-11-23 | — | — | WO | disclosed |
| WO-2006085669-A1 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME | FUJIFILM CORPORATION (JP) | 2006-08-17 | — | — | WO | disclosed |
| US-20050266352-A1 | Forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide is generated in a pattern shape; imparting electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape | FUJI PHOTO FILM CO., LTD. | 2005-12-01 | — | — | US | disclosed |
| US-20050214693-A1 | Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material | FUJI PHOTO FILM CO., LTD. | 2005-09-29 | — | — | US | disclosed |
| EP-1580595-A2 | Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material | FUJI PHOTO FILM CO., LTD. (JP) | 2005-09-28 | — | — | EP | disclosed |
| US-6919158-B2 | Conductive pattern material and method for forming conductive pattern | FUJI PHOTO FILM CO., LTD. (JP) | 2005-07-19 | — | — | US | disclosed |
| US-20030068581-A1 | Conductive pattern material and method for forming conductive pattern | FUJIFILM CORPORATION (JP) | 2003-04-10 | — | — | US | disclosed |
| EP-1282175-A2 | Conductive pattern material and method for forming conductive pattern | FUJI PHOTO FILM CO., LTD. (JP) | 2003-02-05 | — | — | EP | disclosed |