SCHEMBL4178738

SCHEMBL4178738

C=C(CCCOC(=O)CCBr)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.33
FAAH O00519 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
ADRA2A P08913 1/20 0.31
ADRA1A P35348 1/20 0.31
TBXAS1 P24557 2/20 0.31
HTR2C P28335 1/20 0.31
MAPT P10636 1/20 0.31
BLM P54132 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3740064 0.89 ADRA2A (0.33) DGKATDP1ADRA2AADRA1AMAPT
SCHEMBL6131135 0.83 NPC1 (0.38) DGKATDP1ADRA2AADRA1ATBXAS1
SCHEMBL1245604 0.81 DGKA (0.33) DGKATDP1ADRA2AADRA1ATBXAS1
SCHEMBL4942897 0.79 TBXAS1 (0.32) DGKATBXAS1
SCHEMBL3404599 0.79 DGKA (0.43) DGKATBXAS1
SCHEMBL36408 0.76 MGAM (0.39) DGKAFAAHTDP1ADRA2AADRA1A
SCHEMBL6363350 0.76 TSHR (0.38) TDP1TBXAS1
SCHEMBL15401964 0.76 ADRA2A (0.43) DGKATDP1ADRA2AADRA1AHTR2C
SCHEMBL10708066 0.76 MGLL (0.41) DGKATDP1ADRA2AADRA1ATBXAS1
SCHEMBL449324 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1862042-B1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM CORP (JP) 2013-04-10 EP disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-8187664-B2 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same FUJIFILM CORPORATION (JP) 2012-05-29 US disclosed
CN-101120621-B Method of forming metallic pattern, metallic pattern and printed wiring board using it and TFT wiring circuit FUJI PHOTO FILM CO LTD 2011-04-20 CN disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090022885-A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
CN-101120621-A Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit FUJI FILM CORP (JP) 2008-02-06 CN disclosed
EP-1862042-A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM Corporation (JP) 2007-12-05 EP disclosed
WO-2006085669-A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME FUJIFILM CORPORATION (JP) 2006-08-17 WO disclosed