Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13315755 | 0.84 | SHBG (0.33) | DPP4DPP7 | |
| SCHEMBL12305109 | 0.84 | KDM4E (0.33) | — | |
| SCHEMBL10291360 | 0.80 | TFPI2 (0.34) | DPP4DPP7 | |
| SCHEMBL14154937 | 0.72 | CHRM2 (0.33) | DPP4DPP7 | |
| SCHEMBL28306354 | 0.71 | DPP4 (0.46) | DPP4DPP7 | |
| SCHEMBL13954677 | 0.71 | CHRM2 (0.32) | DPP4DPP7 | |
| SCHEMBL13901185 | 0.70 | CHRM2 (0.32) | DPP4DPP7 | |
| SCHEMBL14223497 | 0.70 | ADRB2 (0.33) | DPP4DPP7 | |
| SCHEMBL13954445 | 0.70 | BTK (0.31) | — | |
| SCHEMBL14163688 | 0.69 | CHRM2 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7986085-B2 | Light emitting apparatus and electronic equipment provided with the light emitting apparatus | SEIKO EPSON CORPORATION (JP) | 2011-07-26 | — | — | US | disclosed |
| US-7910226-B2 | Porous semiconductor layer formation material | SEIKO EPSON CORPORATION (JP) | 2011-03-22 | — | — | US | disclosed |
| US-20100324164-A1 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME | NITTO DENKO CORPORATION (JP) | 2010-12-23 | — | — | US | disclosed |
| US-20090284128-A1 | Light emitting apparatus and electronic equipment provided with the light emitting apparatus | SEIKO EPSON CORPORATION (JP) | 2009-11-19 | — | — | US | disclosed |
| US-20090140635-A1 | Porous semiconductor layer formation material | SEIKO EPSON CORPORATION (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090102359-A1 | Light emitting device and electronic equipment provided with the light emitting device | SEIKO EPSON CORPORATION (JP) | 2009-04-23 | — | — | US | disclosed |
| US-20090032807-A1 | Method of Manufacturing Semiconductor Element, Semiconductor Element, Electronic Device, and Electronic Equipment | SEIKO EPSON CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-7396885-B2 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN-EI KAGAKU CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |