2-Mercaptobenzothiazole

2-Mercaptobenzothiazole

SCHEMBL1247155

C.Sc1nc2ccccc2s1

nearest known ligand 0.59

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.52
HSD17B10 Q99714 2/20 0.52
TDP1 Q9NUW8 2/20 0.52
HPGD P15428 2/20 0.52
ADRA2A P08913 1/20 0.52
FBP1 P09467 1/20 0.52
ADORA3 P0DMS8 1/20 0.52
DRD2 P14416 1/20 0.52
ALOX15 P16050 1/20 0.52
ADRA2B P18089 1/20 0.52
ADRA2C P18825 1/20 0.52
DRD1 P21728 1/20 0.52
MC5R P33032 1/20 0.52
OPRM1 P35372 1/20 0.52
DRD3 P35462 1/20 0.52
OPRK1 P41145 1/20 0.52
CCR2 P41597 1/20 0.52
HTR6 P50406 1/20 0.52
SLC6A3 Q01959 1/20 0.52
PDK1 Q15118 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
2-Mercaptobenzothiazole SCHEMBL11526465 1.00 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL23237 0.98 ALDH1A1 (0.54) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL3789760 0.98 ALDH1A1 (0.54) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL29509878 0.98 ALDH1A1 (0.54) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL8158663 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL11575316 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL78798 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL10429471 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL20537310 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A
2-Mercaptobenzothiazole SCHEMBL17684719 0.95 ALDH1A1 (0.52) ALDH1A1HSD17B10TDP1HPGDADRA2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240318052-A1 METHOD OF UNDERWATER BONDING HENKEL AG & CO KGAA (DE) 2024-09-26 US claimed
WO-2023099777-A1 METHOD OF UNDERWATER BONDING Henkel IP & Holding GmbH (DE) 2023-06-08 WO claimed
EP-3464446-B1 TWO-PART CYANOACRYLATE CURABLE ADHESIVE SYSTEM Henkel IP & Holding GmbH (DE) 2021-06-23 EP claimed
CN-109476874-B Two-part cyanoacrylate curable adhesive systems 汉高知识产权控股有限责任公司 2021-04-16 CN claimed
EP-3464446-A1 TWO-PART CYANOACRYLATE CURABLE ADHESIVE SYSTEM Henkel IP & Holding GmbH (DE) 2019-04-10 EP claimed
US-10100235-B2 Two-part cyanoacrylate curable adhesive system Henkel IP & Holding GmbH (DE) 2018-10-16 US claimed
WO-2017202698-A1 TWO-PART CYANOACRYLATE CURABLE ADHESIVE SYSTEM Henkel IP & Holding GmbH (DE) 2017-11-30 WO claimed
US-20170335151-A1 TWO-PART CYANOACRYLATE CURABLE ADHESIVE SYSTEM HENKEL AG & CO. KGAA (DE) 2017-11-23 US claimed
EP-2346956-A1 ACTIVATORS FOR TWO PART CYANOACRYLATE ADHESIVES Loctite (R & D) Limited (IE) 2011-07-27 EP claimed
WO-2010046412-A1 ACTIVATORS FOR TWO PART CYANOACRYLATE ADHESIVES LOCTITE (R & D) LIMITED (IE) 2010-04-29 WO claimed
US-12519071-B2 Structure containing Sn layer or Sn alloy layer ISHIHARA CHEMICAL CO., LTD. (JP) 2026-01-06 US disclosed
EP-3238861-B1 SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL SENJU METAL INDUSTRY CO (JP) 2025-08-27 EP disclosed
US-12388035-B2 Structure comprising under barrier metal and solder layer, and method for producing structure ISHIHARA CHEMICAL CO., LTD. (JP) 2025-08-12 US disclosed
US-20240318052-A1 METHOD OF UNDERWATER BONDING HENKEL AG & CO KGAA (DE) 2024-09-26 US disclosed
US-20240258255-A1 STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METHOD FOR PRODUCING STRUCTURE ISHIHARA CHEMICAL CO., LTD. (JP) 2024-08-01 US disclosed
US-20090321269-A1 SILVER AND SILVER ALLOY PLATING BATH ISHIHARA CHEMICAL CO., LTD. (JP) 2009-12-31 US disclosed
US-7628903-B1 Silver and silver alloy plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2009-12-08 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed
US-6544398-B2 For forming gold-tin alloy plating film; brightness; electronics ISHIHARA CHEMICAL CO., LTD (JP) 2003-04-08 US disclosed
US-20020063063-A1 Non-cyanide-type gold-tin alloy plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2002-05-30 US disclosed