SCHEMBL12488034

SCHEMBL12488034

Cc1ccc(O)c(NC(=O)c2ccc(Cc3ccc(C(=O)Nc4cc(C)ccc4O)cc3)cc2)c1

nearest known ligand 0.71

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 4/20 0.71
▸ HDAC1 Q13547 3/20 0.65
▸ GAA P10253 5/20 0.56
▸ NPC1 O15118 3/20 0.56
▸ TP53 P04637 1/20 0.56
▸ SMN1; SMN2 Q16637 1/20 0.56
▸ RAB9A P51151 2/20 0.54
▸ HPSE Q9Y251 1/20 0.53
▸ ADRB2 P07550 1/20 0.51
▸ MAPT P10636 1/20 0.51
▸ PLK1 P53350 3/20 0.50
▸ PLK3 Q9H4B4 1/20 0.50
▸ CCR5 P51681 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6029542 0.91 KCNMA1 (0.84) KCNMA1HDAC1GAANPC1TP53
SCHEMBL2605548 0.89 KCNMA1 (0.82) KCNMA1HDAC1GAANPC1TP53
SCHEMBL15437080 0.88 KCNMA1 (0.68) KCNMA1HDAC1GAANPC1TP53
SCHEMBL12548985 0.88 KCNMA1 (0.66) KCNMA1HDAC1GAANPC1TP53
SCHEMBL14363236 0.86 KCNMA1 (0.77) KCNMA1HDAC1GAANPC1TP53
SCHEMBL14363234 0.83 KCNMA1 (0.72) KCNMA1HDAC1GAANPC1TP53
SCHEMBL10873010 0.83 KCNMA1 (1.00) KCNMA1HDAC1GAANPC1TP53
SCHEMBL19492015 0.82 KCNMA1 (0.71) KCNMA1HDAC1GAANPC1TP53
SCHEMBL2605541 0.82 KCNMA1 (0.71) KCNMA1HDAC1GAANPC1TP53
SCHEMBL7300963 0.82 KCNMA1 (0.71) KCNMA1HDAC1GAANPC1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 — — EP disclosed
EP-2520977-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2012-11-07 — — EP disclosed
WO-2011080992-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 東レ株式会社 (JP) 2011-07-07 — — WO disclosed
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