⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17019512 | 0.89 | — | — | |
| SCHEMBL13878404 | 0.88 | — | — | |
| SCHEMBL8679000 | 0.88 | — | — | |
| SCHEMBL31093462 | 0.85 | — | — | |
| SCHEMBL126890 | 0.81 | NFKB1 (0.33) | — | |
| SCHEMBL309272 | 0.81 | — | — | |
| Ammonia Solution, Strong SCHEMBL23577300 | 0.79 | NFKB1 (0.32) | — | |
| Putrescine SCHEMBL6283577 | 0.79 | NFKB1 (0.39) | — | |
| SCHEMBL202975 | 0.79 | NFKB1 (0.39) | — | |
| Hydrochloric Acid SCHEMBL8406945 | 0.79 | DNM1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| US-12319814-B2 | Polyamideimide resin, resin composition, and semiconductor device | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| EP-4365237-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-05-08 | — | — | EP | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4026867-B1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-12-06 | — | — | EP | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| WO-2023277134-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276093-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2023-01-05 | — | — | WO | disclosed |
| US-5605942-A | POLYIMIDE HAVING EXCELLENT TRANSPARENCY, OXYGEN PERMEABILITY, HEAT RESISTANCE, ULTRAVIOLET LIGHT ABSORPTION | MENICON CO., LTD. (JP) | 1997-02-25 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |
| EP-0725284-A2 | Ocular lens material | Menicon Co., Ltd. (JP) | 1996-08-07 | — | — | EP | disclosed |
| US-5543442-A | POLYIMIDESILOXANE COPOLYMER | MENICON CO., LTD. (JP) | 1996-08-06 | — | — | US | disclosed |
| EP-0510638-B1 | Silicon-modified polyimide film and process for producing same | CHISSO CORP (JP) | 1995-10-11 | — | — | EP | disclosed |
| EP-0634673-A1 | Ocular lens material | Menicon Co., Ltd. (JP) | 1995-01-18 | — | — | EP | disclosed |
| US-5300364-A | Metal-clad laminates and method for producing same | CHISSO CORPORATION (JP) | 1994-04-05 | — | — | US | disclosed |
| EP-0510638-A1 | Silicon-modified polyimide film and process for producing same | CHISSO CORPORATION (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0498898-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING | CHISSO CORPORATION (JP) | 1992-08-19 | — | — | EP | disclosed |
| EP-0496334-A1 | A flexible base laminated with metal on both the surfaces and a process for producing same | CHISSO CORPORATION (JP) | 1992-07-29 | — | — | EP | disclosed |