⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL126038 | 0.89 | — | — | |
| SCHEMBL9229787 | 0.86 | — | — | |
| SCHEMBL307804 | 0.84 | NFKB1 (0.30) | — | |
| SCHEMBL127783 | 0.82 | DNM1 (0.33) | — | |
| SCHEMBL2921445 | 0.81 | — | — | |
| SCHEMBL125477 | 0.81 | — | — | |
| SCHEMBL196567 | 0.78 | — | — | |
| SCHEMBL8679000 | 0.76 | — | — | |
| SCHEMBL13878404 | 0.76 | — | — | |
| SCHEMBL31093462 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | disclosed |
| US-20220289976-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | TORAY INDUSTRIES, INC. (JP) | 2022-09-15 | — | — | US | disclosed |
| CN-114450351-A | Thermosetting resin composition, thermosetting resin sheet, electronic component, and electronic device | 东丽株式会社 | 2022-05-06 | — | — | CN | disclosed |
| WO-2022059716-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059167-A1 | METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-20 | — | — | US | disclosed |
| US-20070169886-A1 | Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2007-07-26 | — | — | US | disclosed |
| US-20070098995-A1 | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| EP-1721740-A1 | HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2006-11-15 | — | — | EP | disclosed |
| EP-1407879-A1 | HEAT-RESISTANT RESIN FILM WITH METAL LAYER AND WIRING BOARD AND METHOD FOR MANUFACTURING THEM | TORAY INDUSTRIES, INC. (JP) | 2004-04-14 | — | — | EP | disclosed |
| US-20030170431-A1 | Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them | TORAY INDUSTRIES, INC. (JP) | 2003-09-11 | — | — | US | disclosed |
| EP-0510638-B1 | Silicon-modified polyimide film and process for producing same | CHISSO CORP (JP) | 1995-10-11 | — | — | EP | disclosed |
| US-5300364-A | Metal-clad laminates and method for producing same | CHISSO CORPORATION (JP) | 1994-04-05 | — | — | US | disclosed |
| EP-0510638-A1 | Silicon-modified polyimide film and process for producing same | CHISSO CORPORATION (JP) | 1992-10-28 | — | — | EP | disclosed |
| EP-0498898-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING | CHISSO CORPORATION (JP) | 1992-08-19 | — | — | EP | disclosed |
| EP-0496334-A1 | A flexible base laminated with metal on both the surfaces and a process for producing same | CHISSO CORPORATION (JP) | 1992-07-29 | — | — | EP | disclosed |