Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.55 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.53 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.53 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.53 |
| ▸ | SHBG | P04278 | 1/20 | 0.52 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.50 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.47 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.44 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.44 |
| ▸ | CA1 | P00915 | 1/20 | 0.41 |
| ▸ | CA2 | P00918 | 1/20 | 0.41 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.40 |
| ▸ | ALK | Q9UM73 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30374768 | 1.00 | AMY1A (0.55) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL2754938 | 0.98 | SHBG (0.53) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL20762297 | 0.94 | SHBG (0.50) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL2754949 | 0.94 | SHBG (0.60) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL20717779 | 0.92 | SHBG (0.48) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL5685298 | 0.92 | SHBG (0.57) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL7899901 | 0.90 | SHBG (0.47) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL677424 | 0.90 | AMY1A (0.53) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL15830868 | 0.87 | SHBG (0.53) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 | |
| SCHEMBL4057392 | 0.87 | SHBG (0.67) | AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 200 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-1623274-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-02-08 | — | — | EP | claimed |
| EP-1614005-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-01-11 | — | — | EP | claimed |
| US-6905809-B2 | Photoresist compositions | CLARIANT FINANCE (BVI) LIMITED (VG) | 2005-06-14 | — | — | US | claimed |
| WO-2004088423-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| WO-2004088424-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| US-20040197696-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-20040197704-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-6790582-B1 | NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT | CLARIANT FINANCE BVI LIMITED (VG) | 2004-09-14 | — | — | US | claimed |
| JP-9227432-A | — | — | None | — | — | JP | disclosed |
| US-12421349-B2 | Polyphenylene ether composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-09-23 | — | — | US | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-6207788-B1 | FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE | TOKYO OHKA KOGYA CO., LTD. (JP) | 2001-03-27 | — | — | US | disclosed |
| US-6187500-B1 | PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-02-13 | — | — | US | disclosed |
| US-6177226-B1 | PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-23 | — | — | US | disclosed |
| EP-0902326-A2 | Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-03-17 | — | — | EP | disclosed |
| JP-H09227432-A | NEW TETRAKISPHENOL COMPOUND | HONSHU CHEM IND CO LTD | 1997-09-02 | — | — | JP | disclosed |