SCHEMBL1286625

SCHEMBL1286625

C=C[SiH2]c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28320107 0.97 ALDH1A1 (0.46)
SCHEMBL27817206 0.97 ALDH1A1 (0.46)
SCHEMBL28056814 0.97 ALDH1A1 (0.46)
Diethylamine SCHEMBL28794882 0.82 ALDH1A1 (0.34)
SCHEMBL27665825 0.72 ACHE (0.42)
SCHEMBL2564895 0.72 MAPT (0.42)
SCHEMBL1493087 0.71 ALDH1A1 (0.32)
SCHEMBL28864191 0.71
Styrene SCHEMBL6455542 0.69
Propene SCHEMBL28205637 0.69 TSHR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 893 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037581-A High-luminous flux high-color rendering property trichromatic fluorescent powder composition and preparation method thereof 江苏大道新材料有限公司 2026-05-15 CN claimed
CN-119912781-A Resin composition and product thereof 中山台光电子材料有限公司 2025-05-02 CN claimed
US-20250136804-A1 RESIN COMPOSITION AND PRODUCT THEREOF ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2025-05-01 US claimed
US-20250136805-A1 COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRODUCT OF THE SAME ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2025-05-01 US claimed
CN-119751496-A Modified hydrogen-containing silicone oil, single-component heat-conducting gel and preparation method thereof 广州白云科技股份有限公司 2025-04-04 CN claimed
CN-119552515-A Coordination vulcanized organic silicon rubber foaming material and preparation and recycling methods thereof 常州市顺祥新材料科技股份有限公司 2025-03-04 CN claimed
US-12152144-B2 Copolymer, method of preparing the same, resin composition and article made therefrom ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2024-11-26 US claimed
CN-118829067-A Laminate, method for producing same, and use of laminate DIC株式会社 2024-10-22 CN claimed
CN-118685044-A Organic silicon rubber foaming material and preparation method thereof 常州顺程高分子材料有限公司 2024-09-24 CN claimed
CN-118085569-A Preparation method of urea bond reinforced thermoplastic boron-containing organosilicon elastomer 西北工业大学 2024-05-28 CN claimed
CN-102936414-A High refraction and high adhesion large power LED packaging organosilicon material and preparation method thereof HUBEI HUANYU CHEMICAL ENGINEERING CO LTD 2013-02-20 CN claimed
CN-101386476-A Optical fibre softening treating agent RU LU (CN) 2009-03-18 CN claimed
CN-101386706-A Solvent-free flame-retardant glass fiber silicone resin RU LU (CN) 2009-03-18 CN claimed
CN-1309546-C Method for preparing demolding agent for roducing epoxy glass fibre reinforced plastic composite material DONGFANG INSULATION MATERIAL C (CN) 2007-04-11 CN claimed
CN-1554524-A Method for preparing demolding agent for roducing epoxy glass fibre reinforced plastic composite material 四川东方绝缘材料股份有限公司 2004-12-15 CN claimed
EP-0232368-B1 AROMATIC BISMALEIMIDES AND PREPREG RESINS THEREFROM AMOCO CORPORATION (US) 1991-01-16 EP claimed
EP-0148534-B1 BISMALEIMIDES AND PREPREG RESINS THEREFROM AMOCO CORPORATION (US) 1989-03-15 EP claimed
EP-0232368-A1 AROMATIC BISMALEIMIDES AND PREPREG RESINS THEREFROM. AMOCO CORP (US) 1987-08-19 EP claimed
WO-1987000835-A1 AROMATIC BISMALEIMIDES AND PREPREG RESINS THEREFROM AMOCO CORPORATION (US) 1987-02-12 WO claimed
EP-0148534-A1 Bismaleimides and prepreg resins therefrom AMOCO CORPORATION (US) 1985-07-17 EP claimed