SCHEMBL1289864

SCHEMBL1289864

N=C=O.N=C=O.[SiH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27784783 1.00
SCHEMBL3338549 1.00
SCHEMBL706082 1.00
SCHEMBL647320 1.00
SCHEMBL389045 1.00
SCHEMBL315171 1.00
SCHEMBL10891818 1.00
SCHEMBL1669744 1.00
SCHEMBL21880102 1.00
Fluoride SCHEMBL4973760 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114989757-B Low-temperature rapid-curing moisture-heat-resistant epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2023-04-25 CN claimed
CN-114989757-A Low-temperature fast-curing humidity-heat-resistant epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2022-09-02 CN claimed
US-5153068-A Discoloration inhibition SEKISUI FINE CHEMICAL CO., LTD. (JP) 1992-10-06 US claimed
CN-118185532-A High-adhesive-strength epoxy adhesive capable of being rapidly cured at room temperature and preparation method thereof 佛山禾邦新材料科技有限公司 2024-06-14 CN disclosed
WO-2024095661-A1 INKJET RECORDING DEVICE AND INKJET RECORDING METHOD 富士フイルム株式会社 2024-05-10 WO disclosed
CN-117916323-A Non-sagging composition 迈图高新材料公司 2024-04-19 CN disclosed
CN-116888194-A Condensation curable composition comprising a siloxane-imide base polymer 迈图高新材料公司 2023-10-13 CN disclosed
WO-2023195297-A1 ADHESIVE FOR OPTICAL FILM, COATING, AND OPTICAL FILM 第一工業製薬株式会社 2023-10-12 WO disclosed
CN-114989757-B Low-temperature rapid-curing moisture-heat-resistant epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2023-04-25 CN disclosed
CN-114989757-B Low-temperature rapid-curing moisture-heat-resistant epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2023-04-25 CN disclosed
CN-114989757-A Low-temperature fast-curing humidity-heat-resistant epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2022-09-02 CN disclosed
WO-2012045335-A1 PROTON EXCHANGE MEMBRANE UNIVERSITEIT TWENTE (NL) 2012-04-12 WO disclosed
US-7329386-B2 Column packing material and method for producing the same SHISEIDO CO., LTD. (JP) 2008-02-12 US disclosed
EP-1422522-A1 COLUMN PACKING AND PROCESS FOR PRODUCTION THEREOF Shiseido Co., Ltd. (JP) 2004-05-26 EP disclosed
US-20040043493-A1 Column packing material and method for production thereof SANYO FINE IRICA TECHNOLOGY CO., LTD. (JP) 2004-03-04 US disclosed
CN-1388526-A Optical recording film and its producing method, optical recording medium, and information recording reproducing apparatus MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-01-01 CN disclosed
EP-0732361-B1 Ultraviolet absorber and coating material NIPPON OIL CO LTD (JP) 1999-10-06 EP disclosed
US-5627227-A Ultraviolet absorber and coating material NIPPON OIL CO., LTD. (JP) 1997-05-06 US disclosed
EP-0732361-A1 Ultraviolet absorber and coating material NIPPON OIL CO., LTD. (JP) 1996-09-18 EP disclosed
US-4176131-A Chemical process BRISTOL-MYERS COMPANY (US) 1979-11-27 US disclosed