SCHEMBL3338549

SCHEMBL3338549

N=C=O.N=C=O.N=C=O.[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27784783 1.00
SCHEMBL706082 1.00
SCHEMBL647320 1.00
SCHEMBL389045 1.00
SCHEMBL315171 1.00
SCHEMBL1289864 1.00
SCHEMBL10891818 1.00
SCHEMBL1669744 1.00
SCHEMBL21880102 1.00
Fluoride SCHEMBL4973760 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115497748-B Enzymolysis lignin-based carbon coated hard carbon material, preparation method and application thereof 上海汉禾生物新材料科技有限公司 2023-12-08 CN disclosed
US-8206800-B2 Flocked adhesive article having multi-component adhesive film FIBERLOK TECHNOLOGIES, INC. 2012-06-26 US disclosed
US-20100068447-A1 FLOCKED SLURRIED THERMOSETTING ADHESIVE ARTICLE HIGH VOLTAGE GRAPHICS, INC. (US) 2010-03-18 US disclosed
WO-2008076934-A2 FLOCKED SLURRIED THERMOSETTING ADHESIVE ARTICLE HIGH VOLTAGE GRAPHICS, INC. (US) 2008-06-26 WO disclosed
US-20080145585-A1 FLOCKED SLURRIED THERMOSETTING ADHESIVE ARTICLE HIGH VOLTAGE GRAPHICS, INC. (US) 2008-06-19 US disclosed
US-20080124503-A1 FLOCKED ADHESIVE ARTICLE HAVING MULTI-COMPONENT ADHESIVE FILM HIGH VOLTAGE GRAPHICS, INC. (US) 2008-05-29 US disclosed
US-20070110949-A1 FLOCKED ADHESIVE ARTICLE HIGH VOLTAGE GRAPHICS, INC. (US) 2007-05-17 US disclosed