Ethylene Glycol

Ethylene Glycol

SCHEMBL1303233

C=COCC(C)(C)C.OCCO

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL274229 0.92
SCHEMBL7112646 0.78
SCHEMBL8758399 0.77 ALDH1A1 (0.31)
SCHEMBL1303234 0.77
Sulfuric Acid SCHEMBL28057138 0.77 CYP2C19 (0.30)
SCHEMBL110522 0.76
Ethylene Glycol SCHEMBL5805748 0.75 CYP2C19 (0.33)
SCHEMBL65357 0.75
SCHEMBL271099 0.75
Ethylene Glycol SCHEMBL20544240 0.74 CYP2C19 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260035596-A1 COMPOSITIONS FOR POLISHING SUBSTRATES ENTEGRIS INC (US) 2026-02-05 US disclosed
US-20230151138-A1 STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OBTAINED BY CURING CURABLE COMPOSITION ENEOS CORPORATION (JP) 2023-05-18 US disclosed
EP-4130087-A1 STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING SAME, AND CURED OBJECT OBTAINED BY CURING CURABLE COMPOSITION ENEOS Corporation (JP) 2023-02-08 EP disclosed
CN-115279768-A Stereoisomer of epoxy compound, curable composition containing same, and cured product obtained by curing curable composition 引能仕株式会社 2022-11-01 CN disclosed
EP-4071182-A1 ALICYCLIC ACRYLATE COMPOUND, ALICYCLIC EPOXY ACRYLATE COMPOUND, CURABLE COMPOSITION, AND CURED ARTICLE ENEOS Corporation (JP) 2022-10-12 EP disclosed
CN-114746392-A Alicyclic acrylate compound, alicyclic epoxy acrylate compound, curable composition, and cured product 引能仕株式会社 2022-07-12 CN disclosed
US-11384257-B2 Chemical-mechanical polishing composition, rinse composition, chemical-mechanical polishing method, and rinsing method CMC MATERIALS KK 2022-07-12 US disclosed
US-20220204687-A1 A CURABLE COMPOSITION AND A CURED PRODUCT THEREOF ENEOS CORPORATION (JP) 2022-06-30 US disclosed
EP-3954723-A1 CURABLE COMPOSITION AND CURED PRODUCT OF SAME ENEOS Corporation (JP) 2022-02-16 EP disclosed
CN-113646354-A Curable composition and cured product thereof 引能仕株式会社 2021-11-12 CN disclosed
EP-1657268-B1 PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT THEREOF ASAHI KASEI CHEMICALS CORP (JP) 2015-05-27 EP disclosed
WO-2014174365-A2 SLURRY COMPOSITION AND METHOD OF SUBSTRATE POLISHING NIHON CABOT MICROELECTRONICS K.K. (JP) 2014-10-30 WO disclosed
US-8859642-B2 Curable composition, cured article obtained therefrom and process for preparation of the same KANEKA CORPORATION (JP) 2014-10-14 US disclosed
EP-2388280-A1 CURABLE COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND PROCESS FOR PRODUCING SAME Kaneka Corporation (JP) 2011-11-23 EP disclosed
US-20110269894-A1 CURABLE COMPOSITION, CURED ARTICLE OBTAINED THEREFROM AND PROCESS FOR PREPARATION OF THE SAME KANEKA CORPORATION (JP) 2011-11-03 US disclosed
US-8038733-B2 Composition and system for hair coloring and color retention FAROUK SYSTEMS, INC. (US) 2011-10-18 US disclosed
US-7569260-B2 Photosensitive composition and cured products thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-08-04 US disclosed
US-20060222999-A1 Photosensitive composition and cured products thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2006-10-05 US disclosed
EP-1657268-A1 PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT THEREOF Asahi Kasei Chemicals Corporation (JP) 2006-05-17 EP disclosed
US-6235358-B1 COATING LAYERS OF EPOXY RESINS AND PHOTOCATIONIC CURING CATALTST WITH CATIONIC SULFUR ESTERS, SENSITIZERS OF THIOXANTHONES AND TITANIUM DIOXIDE PIGMENTS TOYO SEIKAN KAISHA, LTD. (JP) 2001-05-22 US disclosed