Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.42 |
| ▸ | DUSP3 | P51452 | 2/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.42 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.42 |
| ▸ | PYGL | P06737 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | CA12 | O43570 | 1/20 | 0.36 |
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 1/20 | 0.36 |
| ▸ | CA9 | Q16790 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6539146 | 0.72 | PHGDH (0.36) | ALDH1A1PYGLCYP1A2GAASMN1; SMN2 | |
| SCHEMBL15259538 | 0.69 | PHGDH (0.40) | ALDH1A1CYP1A2GAA | |
| SCHEMBL21548998 | 0.69 | SIGMAR1 (0.40) | ALDH1A1KDM4EL3MBTL1SMN1; SMN2 | |
| SCHEMBL20879993 | 0.68 | EPHX1 (0.43) | ALDH1A1EPHX1GAASMN1; SMN2 | |
| SCHEMBL27837836 | 0.68 | SIGMAR1 (0.42) | PYGLL3MBTL1GAASMN1; SMN2CA2 | |
| SCHEMBL6074931 | 0.67 | SIGMAR1 (0.41) | ALDH1A1PYGLCYP1A2GAA | |
| SCHEMBL28647785 | 0.67 | ALDH1A1 (0.46) | ALDH1A1 | |
| SCHEMBL16440026 | 0.66 | HSD17B10 (0.42) | ALDH1A1KDM4EL3MBTL1EPHX1GAA | |
| SCHEMBL13045318 | 0.66 | KEAP1 (0.51) | ALDH1A1CYP1A2EPHX1GAASMN1; SMN2 | |
| SCHEMBL13046530 | 0.66 | KEAP1 (0.51) | ALDH1A1CYP1A2EPHX1GAASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 118 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4210089-A1 | METHOD FOR MANUFACTURING ORGANIC LAYER PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2023-07-12 | — | — | EP | disclosed |
| CN-115244470-A | Removing liquid, kit and semiconductor device | 富士胶片株式会社 | 2022-10-25 | — | — | CN | disclosed |
| US-20220082941-A1 | LAMINATE, COMPOSITION, AND, LAMINATE FORMING KIT | FUJIFILM CORPORATION (JP) | 2022-03-17 | — | — | US | disclosed |
| WO-2022050313-A1 | METHOD FOR MANUFACTURING ORGANIC LAYER PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| US-20220075265-A1 | Laminate, composition, and, laminate forming kit | FUJIFILM CORPORATION (JP) | 2022-03-10 | — | — | US | disclosed |
| US-20220066323-A1 | Laminate, composition, and laminate forming kit | FUJIFILM CORPORATION (JP) | 2022-03-03 | — | — | US | disclosed |
| CN-113574455-A | Laminate, composition, and laminate-forming kit | 富士胶片株式会社 | 2021-10-29 | — | — | CN | disclosed |
| EP-3064997-B1 | LAMINATE AND USE OF A KIT FOR MANUFACTURING OF A LAMINATE | FUJIFILM CORP (JP) | 2021-04-28 | — | — | EP | disclosed |
| US-10833272-B2 | Laminate and kit | FUJIFILM CORPORATION (JP) | 2020-11-10 | — | — | US | disclosed |
| WO-2020195995-A1 | MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY | 富士フイルム株式会社 | 2020-10-01 | — | — | WO | disclosed |
| US-20030031950-A1 | A compound capable of generating an acid upon irradiation; a resin capable of decomposing by the action of an acid to increase the solubility; and a specified dissolution-inhibiting compound. | FUJI PHOTO FILM CO., LTD | 2003-02-13 | — | — | US | disclosed |
| US-6506535-B1 | A positive working photoresist composition for use in the production of semiconductor integrated circuit devices, mask for the production of integrated circuits, printed wiring boards, liquid crystal panels | FUJI PHOTO FILM CO., LTD. (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20030008241-A1 | Positive-working resist composition | FUJI PHOTO FILM CO., LTD. | 2003-01-09 | — | — | US | disclosed |
| US-6479211-B1 | FOR FAR ULTRAVIOLET EXPOSURE, WHICH CAN FORM A HIGHLY PRECISE PATTERN USING LIGHT IN THE FAR ULTRAVIOLET REGION INCLUDING AN EXCIMER LASER RAY, PARTICULARLY, IN THE REGION OF 250 NM OR LESS | FUJI PHOTO FILM CO., LTD. (JP) | 2002-11-12 | — | — | US | disclosed |
| US-20020064727-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. | 2002-05-30 | — | — | US | disclosed |
| US-20020048720-A1 | Positive photoresist composition | FUJIFILM CORPORATION (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20020009666-A1 | Positive photoresist composition | FUJIFILM CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| US-20010041303-A1 | Positive photoresist composition | FUJIFILM CORPORATION (JP) | 2001-11-15 | — | — | US | disclosed |
| EP-1096319-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1091248-A1 | Postive-working resist composition | FUJI PHOTO FILM CO., LTD. (JP) | 2001-04-11 | — | — | EP | disclosed |