Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.51 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | MGLL | Q99685 | 3/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1307985 | 0.92 | ALDH1A1 (0.56) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL2952137 | 0.90 | ALDH1A1 (0.54) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL4103624 | 0.90 | ALDH1A1 (0.54) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL14859867 | 0.87 | ALDH1A1 (0.57) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL4865011 | 0.84 | ALDH1A1 (0.58) | ALDH1A1TP53CYP3A4SMN1; SMN2TDP1 | |
| SCHEMBL9441611 | 0.83 | ALDH1A1 (0.57) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL607207 | 0.83 | ALDH1A1 (0.57) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL866090 | 0.83 | ALDH1A1 (0.57) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL631946 | 0.83 | ALDH1A1 (0.60) | ALDH1A1TP53CYP3A4SMN1; SMN2MGLL | |
| SCHEMBL8054764 | 0.81 | ALDH1A1 (0.61) | ALDH1A1TP53CYP3A4MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 216 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111909491-B | Photo-sensitive composite resin for photo-curing 3D printing and preparation method thereof | 广东工业大学 | 2023-02-07 | — | — | CN | claimed |
| CN-115569536-A | Anti-pollution ultrafiltration membrane and preparation method and application thereof | 浙江大学 | 2023-01-06 | — | — | CN | claimed |
| CN-113004455-B | Macromolecular anionic-nonionic emulsifier and preparation method thereof | 扬州工业职业技术学院 | 2022-05-27 | — | — | CN | claimed |
| CN-110172228-B | Lignin epoxy resin/carbon fiber reinforced anti-aging composite material | 山西舜质新材料科技有限公司 | 2021-08-03 | — | — | CN | claimed |
| CN-113004455-A | Macromolecular anionic-nonionic emulsifier and preparation method thereof | 扬州工业职业技术学院 | 2021-06-22 | — | — | CN | claimed |
| CN-112745235-A | Cardanol modification method, modified cardanol, photoresist and application of photoresist | 阜阳欣奕华材料科技有限公司 | 2021-05-04 | — | — | CN | claimed |
| CN-112534006-A | Production of decorated leather | 爱克发有限公司 | 2021-03-19 | — | — | CN | claimed |
| CN-111909491-A | Photosensitive composite resin for photocuring 3D printing and preparation method thereof | 广东工业大学 | 2020-11-10 | — | — | CN | claimed |
| CN-111298190-A | Hemostatic material for infants and preparation method thereof | 杨晓菲 | 2020-06-19 | — | — | CN | claimed |
| CN-111253609-A | Method for preparing modified polymer membrane material, material obtained by method and application of material | 中国科学院上海应用物理研究所 | 2020-06-09 | — | — | CN | claimed |
| EP-2109881-B1 | SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL | HENKEL AG & CO KGAA (DE) | 2018-09-26 | — | — | EP | claimed |
| US-8212369-B2 | Semiconductor wafer coated with a filled, spin-coatable material | HENKEL AG & CO. KGAA (DE) | 2012-07-03 | — | — | US | claimed |
| US-20100193973-A1 | SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL | HENKEL AG & CO. KGAA (DE) | 2010-08-05 | — | — | US | claimed |
| JP-2010517316-A | — | — | 2010-05-20 | — | — | JP | claimed |
| EP-2109881-A1 | SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL | Henkel AG & Co. KGaA (DE) | 2009-10-21 | — | — | EP | claimed |
| WO-2008094149-A1 | SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL | HENKEL AG & CO. KGAA (DE) | 2008-08-07 | — | — | WO | claimed |
| US-20240227256-A1 | THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT | IDEMITSU KOSAN CO.,LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240208116-A1 | THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT | IDEMITSU KOSAN CO.,LTD. (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-1710626-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2006-10-11 | — | — | EP | disclosed |
| WO-2003095506-A1 | RADIATION CURABLE COMPOSITIONS | UCB, S.A. (BE) | 2003-11-20 | — | — | WO | disclosed |