SCHEMBL2952137

SCHEMBL2952137

C=C(CCCCCO)C(=O)OCC1CO1

nearest known ligand 0.54

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.54
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
MGLL Q99685 3/20 0.39
LMNA P02545 1/20 0.33
POLB P06746 1/20 0.33
GPR84 Q9NQS5 1/20 0.33
FFAR1 O14842 1/20 0.33
FFAR4 Q5NUL3 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4103624 1.00 ALDH1A1 (0.54) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL1307985 0.98 ALDH1A1 (0.56) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL14859867 0.94 ALDH1A1 (0.57) ALDH1A1TP53CYP3A4MGLLLMNA
Ether SCHEMBL1307983 0.90 ALDH1A1 (0.51) ALDH1A1TP53CYP3A4MGLL
SCHEMBL8054764 0.87 ALDH1A1 (0.61) ALDH1A1TP53CYP3A4MGLL
SCHEMBL9441611 0.86 ALDH1A1 (0.57) ALDH1A1
SCHEMBL607207 0.86 ALDH1A1 (0.57) ALDH1A1
SCHEMBL866090 0.86 ALDH1A1 (0.57) ALDH1A1
SCHEMBL9129116 0.86 ALDH1A1 (0.56) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL4865011 0.84 ALDH1A1 (0.58) ALDH1A1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3222692-B1 INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART SEKISUI CHEMICAL CO LTD (JP) 2023-07-12 EP claimed
EP-2440583-B1 LOW VISCOSITY HIGH SOLIDS COPOLYMER SWIMC LLC (US) 2023-05-03 EP claimed
EP-3270155-B1 PACKING MATERIAL FOR LIQUID CHROMATOGRAPHY SHOWA DENKO KK (JP) 2022-06-29 EP claimed
EP-3162434-B1 HOLLOW PARTICLES SEKISUI PLASTICS (JP) 2020-02-26 EP claimed
EP-3249024-B1 INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT SEKISUI CHEMICAL CO LTD (JP) 2019-08-28 EP claimed
EP-3066255-A1 USE OF BINDER COMPOSITIONS FOR PRODUCING TEXTILE SHEET PRODUCTS Wacker Chemie AG (DE) 2016-09-14 EP claimed
EP-2620479-B1 CURABLE COMPOSITION FOR INKJET, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT SEKISUI CHEMICAL CO LTD (JP) 2016-06-22 EP claimed
US-20130208064-A1 CURABLE COMPOSITION FOR INKJET, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT SEKISUI CHEMICAL CO., LTD. (JP) 2013-08-15 US claimed
US-20090076183-A1 Radiation curable methacrylate polyesters CYTEC SURFACE SPECIALTIES, S.A. (BE) 2009-03-19 US claimed
US-20080124456-A1 Inkjet ink and method for forming cured film using the same CHISSO CORPORATION 2008-05-29 US claimed
US-20080103280-A1 Ink-jet ink and cured film obtained from same CHISSO CORPORATION 2008-05-01 US claimed
EP-1879941-A1 RADIATION CURABLE METHACRYLATE POLYESTERS CYTEC SURFACE SPECIALTIES, S.A. (BE) 2008-01-23 EP claimed
WO-2006117157-A1 RADIATION CURABLE METHACRYLATE POLYESTERS CYTEC SURFACE SPECIALTIES, S.A. (BE) 2006-11-09 WO claimed
US-12018107-B2 Polymer material, composition, and method of manufacturing semiconductor device KIOXIA CORPORATION (JP) 2024-06-25 US disclosed
WO-2024128086-A1 CURABLE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE 富士フイルム株式会社 2024-06-20 WO disclosed
EP-3998252-B1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS SHIKOKU CHEM (JP) 2024-04-24 EP disclosed
EP-1857514-A1 Oil-based ink compositions for inkjet printers The Inctec Inc. (JP) 2007-11-21 EP disclosed
WO-2006117157-A1 RADIATION CURABLE METHACRYLATE POLYESTERS CYTEC SURFACE SPECIALTIES, S.A. (BE) 2006-11-09 WO disclosed
US-20060051549-A1 Resin composition, transfer material and process for producing shaped item KYOEISHA CHEMICAL CO., LTD (JP) 2006-03-09 US disclosed
EP-1559731-A1 RESIN COMPOSITION, TRANSFER MATERIAL AND PROCESS FOR PRODUCING SHAPED ITEM Kyoeisha Chemical Co., Ltd. (JP) 2005-08-03 EP disclosed