SCHEMBL1307985

SCHEMBL1307985

C=C(CCCCO)C(=O)OCC1CO1

nearest known ligand 0.56

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.56
TP53 P04637 1/20 0.40
CYP3A4 P08684 1/20 0.40
MGLL Q99685 3/20 0.37
LMNA P02545 1/20 0.34
POLB P06746 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2952137 0.98 ALDH1A1 (0.54) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL4103624 0.98 ALDH1A1 (0.54) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL14859867 0.95 ALDH1A1 (0.57) ALDH1A1TP53CYP3A4MGLLLMNA
Ether SCHEMBL1307983 0.92 ALDH1A1 (0.51) ALDH1A1TP53CYP3A4MGLL
SCHEMBL8054764 0.88 ALDH1A1 (0.61) ALDH1A1TP53CYP3A4MGLL
SCHEMBL9129116 0.87 ALDH1A1 (0.56) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL4865011 0.86 ALDH1A1 (0.58) ALDH1A1TP53CYP3A4
SCHEMBL9130188 0.85 ALDH1A1 (0.57) ALDH1A1TP53CYP3A4MGLLLMNA
SCHEMBL9441611 0.84 ALDH1A1 (0.57) ALDH1A1
SCHEMBL607207 0.84 ALDH1A1 (0.57) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 349 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115245591-B Degradable embolism microsphere and preparation method thereof 苏州浩微生物医疗科技有限公司 2024-06-14 CN claimed
CN-118085188-A Stable foam type polycarboxylic acid slump retaining agent and preparation method and application thereof 科之杰新材料集团有限公司 2024-05-28 CN claimed
CN-117089014-B Acrylate copolymer, adhesive and protective film 江苏皇冠新材料科技有限公司 2024-01-26 CN claimed
CN-117089014-A Acrylate copolymer, adhesive and protective film 江苏皇冠新材料科技有限公司 2023-11-21 CN claimed
EP-3650499-B1 ELECTROCONDUCTIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SHIELDED PACKAGE USING SAME TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP) 2023-11-08 EP claimed
CN-116903825-A Modified polyurethane acrylate resin, adhesive and preparation method thereof 上海汉司实业有限公司 2023-10-20 CN claimed
CN-116875217-A Polyester protective film and application thereof 安徽国风新材料股份有限公司 2023-10-13 CN claimed
CN-116284718-A High-melt-strength polylactic acid and preparation method thereof 常州大学 2023-06-23 CN claimed
CN-112316927-B Water treatment agent capable of rapidly adsorbing methylene blue and preparation method thereof 扬州工业职业技术学院 2023-04-25 CN claimed
CN-115776996-A Organic microparticles 大金工业株式会社 2023-03-10 CN claimed
US-8212369-B2 Semiconductor wafer coated with a filled, spin-coatable material HENKEL AG & CO. KGAA (DE) 2012-07-03 US claimed
US-20100193973-A1 SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL HENKEL AG & CO. KGAA (DE) 2010-08-05 US claimed
EP-1889857-B1 NOVEL PACKING MATERIAL WITH EXCELLENT HYDROPHILICITY AND PROCESS FOR PRODUCING THE SAME TOSOH CORP (JP) 2010-07-21 EP claimed
JP-2010517316-A 2010-05-20 JP claimed
EP-1784435-B1 METHODS FOR PRODUCING CROSSLINKABLE OLIGOMERS NUPLEX RESINS BV (NL) 2009-11-11 EP claimed
EP-2109881-A1 SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL Henkel AG & Co. KGaA (DE) 2009-10-21 EP claimed
US-20090076183-A1 Radiation curable methacrylate polyesters CYTEC SURFACE SPECIALTIES, S.A. (BE) 2009-03-19 US claimed
WO-2008094149-A1 SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL HENKEL AG & CO. KGAA (DE) 2008-08-07 WO claimed
EP-1879941-A1 RADIATION CURABLE METHACRYLATE POLYESTERS CYTEC SURFACE SPECIALTIES, S.A. (BE) 2008-01-23 EP claimed
WO-2006117157-A1 RADIATION CURABLE METHACRYLATE POLYESTERS CYTEC SURFACE SPECIALTIES, S.A. (BE) 2006-11-09 WO claimed