Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25873070 | 0.87 | CYP3A4 (0.33) | CYP3A4TSHR | |
| SCHEMBL2603375 | 0.86 | CYP3A4 (0.39) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL16545330 | 0.86 | CYP3A4 (0.39) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL24990 | 0.85 | ESR1 (0.45) | ESR1ESR2 | |
| SCHEMBL34741 | 0.85 | CYP3A4 (0.47) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL3382230 | 0.84 | CYP3A4 (0.40) | CYP3A4TSHRESR1ESR2MAPK1 | |
| SCHEMBL940009 | 0.83 | CYP3A4 (0.48) | CYP3A4TSHRESR1ESR2MAPK1 | |
| SCHEMBL12908787 | 0.83 | TSHR (0.37) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL25873141 | 0.83 | CYP3A4 (0.37) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL10033172 | 0.80 | CYP3A4 (0.42) | CYP3A4TSHRMAPK1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8501874-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2013-08-06 | — | — | US | disclosed |
| US-7816437-B2 | Polymide resin composition modified with bismaleimide and cyanate | CHANG CHUN PLASTICS CO., LTD. (TW) | 2010-10-19 | — | — | US | disclosed |
| US-7521511-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| US-20080312383-A1 | Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same | KANEKA CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20080306220-A1 | Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board | KANEKA CORPORATION (JP) | 2008-12-11 | — | — | US | disclosed |
| US-20080176984-A1 | Thermoset resin modified polyimide resin composition | CHANG CHUN PLASTICS CO., LTD. | 2008-07-24 | — | — | US | disclosed |