SCHEMBL24990

SCHEMBL24990

N#COc1ccc(C(c2ccc(OC#N)cc2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.45

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
KIF11 P52732 1/20 0.31
AR P10275 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24858767 0.93 ESR1 (0.39) ESR1ESR2KIF11
SCHEMBL24858766 0.91 AR (0.39) ESR1ESR2KIF11AR
SCHEMBL13084705 0.85 CYP3A4 (0.36) ESR1ESR2
SCHEMBL10627367 0.83 KIF11 (0.33) KIF11
SCHEMBL4376536 0.83 KIF11 (0.47) KIF11
Hydrogen Sulfide SCHEMBL28175895 0.81 KIF11 (0.45) KIF11
SCHEMBL28868994 0.80
SCHEMBL28868996 0.79 AR (0.31) AR
SCHEMBL17042662 0.78 NPC1 (0.31) KIF11
SCHEMBL7702002 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1030 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12098256-B2 Resin film and uses thereof CHANG CHUN PLASTICS CO., LTD. (TW) 2024-09-24 US claimed
CN-118325330-A Preparation method of low-dielectric cyanate resin based on hyperbranched structure 电子科技大学 2024-07-12 CN claimed
CN-118109076-A Plastic film ink with bonding function 杭州谦之缘包装材料有限公司 2024-05-31 CN claimed
CN-117757261-A Resin film and use thereof 长春人造树脂厂股份有限公司 2024-03-26 CN claimed
US-20240092984-A1 RESIN FILM AND USES THEREOF CHANG CHUN PLASTICS CO., LTD. (TW) 2024-03-21 US claimed
EP-4232421-A1 DIELECTRIC FILM-FORMING COMPOSITION FUJIFILM Electronic Materials U.S.A, Inc. (US) 2023-08-30 EP claimed
CN-116635571-A Dielectric film forming composition 富士胶片电子材料美国有限公司 2023-08-22 CN claimed
CN-114702667-B Low-dielectric cyanate resin based on intermolecular action and preparation method thereof 电子科技大学 2023-04-07 CN claimed
CN-114702667-A Low-dielectric cyanate resin based on intermolecular action and preparation method thereof 电子科技大学 2022-07-05 CN claimed
CN-110885428-B Halogen-free thermosetting resin composition, prepreg using same, laminated board and printed circuit board 广东生益科技股份有限公司 2022-06-28 CN claimed
EP-1275696-A1 RESIN COMPOSITION WITH EXCELLENT DIELECTRIC CHARACTERISTICS, PROCESS FOR PRODUCING RESIN COMPOSITION, VARNISH PREPARED FROM THE SAME, PROCESS FOR PRODUCING THE SAME, PREPREG MADE WITH THESE, AND METAL-CLAD LAMINATE Hitachi Chemical Co., Ltd. (JP) 2003-01-15 EP claimed
EP-1265947-A1 QUICK-SETTING MIXTURES AND KITS WITH POLYFUNCTIONAL CYANATES AND AMINES, THE THERMOSETS PRODUCED THEREFROM AND METHODS FOR THE PRODUCTION THEREOF FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) 2002-12-18 EP claimed
US-20020107308-A1 Curable epoxy resin compositions and the cured residues thereof CITIBANK, N.A., AS COLLATERAL AGENT 2002-08-08 US claimed
WO-2001068741-A1 QUICK-SETTING MIXTURES AND KITS WITH POLYFUNCTIONAL CYANATES AND AMINES, THE THERMOSETS PRODUCED THEREFROM AND METHODS FOR THE PRODUCTION THEREOF Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2001-09-20 WO claimed
US-5969036-A COMPOSITION FOR ATTACHING SEMICONDUCTOR DEVICE TO SUBSTRATE COMPRISING LIQUID MONOMER VEHICLE COMPRISING HYDROPHOBIC CYANATE ESTER MONOMER AND EPOXY MONOMER, FILLER, METAL CATALYST, IMIDAZOLE THE DEXTER CORPORATION (US) 1999-10-19 US claimed
EP-0581314-B1 Modified dicyanate ester resins having enhanced fracture thoughness IBM (US) 1997-09-17 EP claimed
US-5548034-A A BLEND OF FLUORINE CONTAINING CYANATE AND FLUORINE CONTAINING POLY(ARYLENE ETHER); HEAT CURABLE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1996-08-20 US claimed
US-5464726-A Making resist image by exposing positive photosensitive composition /cyanate ester and cationic photoinitiator generating Bronsted acid upon exposure to actinic light/ in predetermined pattern to actinic light, heating, developing INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-11-07 US claimed
EP-0581314-A2 Modified dicyanate ester resins having enhanced fracture thoughness International Business Machines Corporation (US) 1994-02-02 EP claimed
EP-0413087-A1 Photosensitive composition and use thereof International Business Machines Corporation (US) 1991-02-20 EP claimed