SCHEMBL3382230

SCHEMBL3382230

O=C=Nc1ccc(Oc2ccc(C(c3ccc(Oc4ccc(N=C=O)cc4)cc3)(C(F)(F)F)C(F)(F)F)cc2)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP3A4 P08684 2/20 0.40
▸ TSHR P16473 1/20 0.40
▸ ESR1 P03372 1/20 0.38
▸ ESR2 Q92731 1/20 0.38
▸ MAPK1 P28482 2/20 0.34
▸ TDP1 Q9NUW8 1/20 0.34
▸ TRPA1 O75762 1/20 0.33
▸ ADRA2A P08913 1/20 0.32
▸ ADRA2B P18089 1/20 0.32
▸ ADRA2C P18825 1/20 0.32
▸ PTPN1 P18031 1/20 0.32
▸ CYP1A2 P05177 1/20 0.31
▸ NPC1 O15118 1/20 0.31
▸ ALDH1A1 P00352 1/20 0.31
▸ MAPT P10636 1/20 0.31
▸ HPGD P15428 1/20 0.31
▸ RAB9A P51151 1/20 0.31
▸ PRSS1 P07477 1/20 0.31
▸ ACR P10323 1/20 0.31
▸ MEN1 O00255 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL940009 0.89 CYP3A4 (0.48) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL10546748 0.88 CYP3A4 (0.41) CYP3A4TSHRMAPK1TDP1ALDH1A1
SCHEMBL13084705 0.84 CYP3A4 (0.36) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL4551613 0.83 CYP3A4 (0.54) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL4544188 0.83 CYP3A4 (0.54) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL50333 0.83 CYP3A4 (0.54) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL14493730 0.82 CYP3A4 (0.42) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL1949466 0.81 TSHR (0.41) CYP3A4TSHRESR1ESR2MAPK1
SCHEMBL7049085 0.79 LTA4H (0.35) CYP3A4TSHRMAPK1CYP1A2ALDH1A1
SCHEMBL1415412 0.77 CYP3A4 (0.48) CYP3A4TSHRESR1ESR2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-10251511-A — — None — — JP disclosed
EP-1385027-B1 Process of producing polymer optical waveguide NITTO DENKO CORP (JP) 2010-11-24 — — EP disclosed
US-7487586-B2 Process for producing semiconductor device NITTO DENKO CORPORATION (JP) 2009-02-10 — — US disclosed
EP-1315220-B1 BATTERY NITTO DENKO CORP (JP) 2008-12-31 — — EP disclosed
US-7221007-B2 Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet NITTO DENKO CORPORATION (JP) 2007-05-22 — — US disclosed
US-7189591-B2 Process for producing light-emitting semiconductor device NITTO DENKO CORPORATION (JP) 2007-03-13 — — US disclosed
US-20060118973-A1 Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet NITTO DENKO CORPORATION 2006-06-08 — — US disclosed
EP-1657756-A2 Sheet for optical semiconductor element encapsulation and process for producing optical semiconductor device with the sheet NITTO DENKO CORPORATION (JP) 2006-05-17 — — EP disclosed
US-20060089464-A1 Resin composition for optical use NITTO DENKO CORPORATION 2006-04-27 — — US disclosed
EP-1650238-A2 Polycarbodiimide compositions for optical use NITTO DENKO CORPORATION (JP) 2006-04-26 — — EP disclosed
US-6228972-B1 HEAT AND MOISTURE RESISTANT POLYCARBODIIMIDE FORMED FROM M-PHENYLENEDIISOCYANATE MONOMER BEARING A HYDROPHOBIC ALIPHATIC OR FLUOROALIPHATIC HYDROCARBYLOXY GROUP; HIGH SOLVENT SOLUBILITY, PROCESSABILITY NITTO DENKO CORPORATION (JP) 2001-05-08 — — US disclosed
EP-0995739-A1 Aromatic polycarbodiimide and polycarbodiimide sheet NITTO DENKO CORPORATION (JP) 2000-04-26 — — EP disclosed
US-6023096-A Semiconductor device having metal foil integral with sealing resin NITTO DENKO CORPORATION (JP) 2000-02-08 — — US disclosed
US-6001951-A Aromatic polycarbodiimide and film thereof NITTO DENKO CORPORATION (JP) 1999-12-14 — — US disclosed
EP-0915109-A1 Aromatic polycarbodiimide and film thereof NITTO DENKO CORPORATION (JP) 1999-05-12 — — EP disclosed
US-5859170-A CONTAINING SILOXANE BOND IN POLYMER MAIN CHAIN; HEAT RESISTANCE, STORAGE STABILITY NITTO DENKO CORPORATION (JP) 1999-01-12 — — US disclosed
JP-H10251511-A PASTE COMPOSITION NITTO DENKO CORP 1998-09-22 — — JP disclosed
EP-0810244-A2 Aromatic polycarbodiimide and sheet using it NITTO DENKO CORPORATION (JP) 1997-12-03 — — EP disclosed
EP-0792897-A1 Aromatic polycarbodiimide and films thereof NITTO DENKO CORPORATION (JP) 1997-09-03 — — EP disclosed
US-5654474-A Aromatic diisocyanate and method of producing the same NITTO DENKO CORPORATION (JP) 1997-08-05 — — US disclosed
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