SCHEMBL13086314

SCHEMBL13086314

COc1ccc(C(=O)Nc2ccc(O)c(N)c2)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 12/20 0.67
RAB9A P51151 11/20 0.67
SMN1; SMN2 Q16637 7/20 0.67
TP53 P04637 6/20 0.67
ALOX15 P16050 1/20 0.67
ALDH1A1 P00352 4/20 0.63
KMT2A Q03164 3/20 0.61
MEN1 O00255 2/20 0.61
CYP1A2 P05177 2/20 0.61
CYP3A4 P08684 1/20 0.61
GAA P10253 1/20 0.61
CYP2D6 P10635 1/20 0.61
CYP2C9 P11712 1/20 0.61
CYP2C19 P33261 1/20 0.61
PKM P14618 2/20 0.61
KCNK9 Q9NPC2 1/20 0.59
NFKB1 P19838 2/20 0.58
NFKB2 Q00653 2/20 0.58
RELA Q04206 2/20 0.58
HDAC1 Q13547 3/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17507538 0.91 NPC1 (0.67) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL11309004 0.86 NPC1 (0.76) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL7916064 0.84 NPC1 (0.65) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL11573279 0.84 NPC1 (0.65) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL11192829 0.84 NPC1 (0.64) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL28307210 0.83 TOP1 (0.62) NPC1RAB9ATP53ALOX15KMT2A
SCHEMBL6580095 0.83 NPC1 (0.67) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL1455276 0.82 RAB9A (0.62) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL21475214 0.82 NPC1 (0.65) NPC1RAB9ASMN1; SMN2TP53ALOX15
SCHEMBL30017278 0.82 NPC1 (0.65) NPC1RAB9ASMN1; SMN2TP53ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-8420291-B2 Positive photosensitive resin composition, method for forming pattern, electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-04-16 US disclosed
US-20100258336-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed