SCHEMBL1325513

SCHEMBL1325513

CCC(c1ccccc1OC#N)c1ccccc1OC#N

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.36
IDO1 P14902 1/20 0.35
TDO2 P48775 1/20 0.35
SGMS2 Q8NHU3 7/20 0.35
ALDH1A1 P00352 5/20 0.35
LMNA P02545 3/20 0.35
KDM4E B2RXH2 1/20 0.34
CYP1A2 P05177 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
L3MBTL1 Q9Y468 2/20 0.33
TSHR P16473 1/20 0.33
BCHE P06276 1/20 0.33
TYR P14679 1/20 0.33
ACHE P22303 1/20 0.33
GLA P06280 1/20 0.33
GAA P10253 1/20 0.33
ATM Q13315 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15224419 0.87 MEN1 (0.39) SGMS2ALDH1A1LMNAL3MBTL1BCHE
SCHEMBL1789840 0.79 AR (0.34) IDO1TDO2SGMS2ALDH1A1LMNA
SCHEMBL7916958 0.78 PKM (0.30)
SCHEMBL15224638 0.78 MEN1 (0.36) SGMS2ALDH1A1LMNAL3MBTL1GAA
SCHEMBL11750476 0.78 IDO1 (0.53) IDO1TDO2ALDH1A1CYP2C19L3MBTL1
SCHEMBL27228694 0.78 ALDH1A1 (0.33) SGMS2ALDH1A1LMNA
SCHEMBL7916891 0.77 TSHR (0.32) SGMS2ALDH1A1KDM4ETSHR
SCHEMBL15224514 0.77 MEN1 (0.37) SGMS2ALDH1A1LMNAL3MBTL1GAA
SCHEMBL15224464 0.77 MEN1 (0.42) SGMS2ALDH1A1LMNAL3MBTL1GAA
Ammonia Solution, Strong SCHEMBL6001135 0.76 IDO1 (0.52) IDO1TDO2ALDH1A1CYP2C19L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050288458-A1 Reworkable thermosetting resin composition KLEMARCZYK PHILIP T 2005-12-29 US claimed
US-6887737-B1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom HENKEL CORPORATION (US) 2005-05-03 US claimed
US-6657031-B1 Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors LOCTITE CORPORATION 2003-12-02 US claimed
US-6572980-B1 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics HENKEL LOCTITE CORPORATION 2003-06-03 US claimed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US claimed
JP-1006019-A None JP disclosed
EP-3357959-B1 LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF ARLON LLC (US) 2020-11-25 EP disclosed
US-10418148-B2 Low loss pre-pregs and laminates and compositions useful for the preparation thereof ARLON LLC (US) 2019-09-17 US disclosed
US-10123412-B2 Thermosetting polymer formulations, circuit materials, and methods of use thereof ROGERS CORPORATION (US) 2018-11-06 US disclosed
EP-3357959-A1 LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF Arlon (US) 2018-08-08 EP disclosed
US-20170287589-A1 Low Loss Pre-Pregs and Laminates and Compositions Useful for the Preparation Thereof JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2017-10-05 US disclosed
WO-2017132310-A1 THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF ROGERS CORPORATION (US) 2017-08-03 WO disclosed
WO-2003072673-A2 ADHESIVE COMPOSITIONS CONTAINING ORGANIC SPACERS AND METHODS FOR USE THEREOF HENKEL LOCTITE CORPORATION (US) 2003-09-04 WO disclosed
US-6572980-B1 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics HENKEL LOCTITE CORPORATION 2003-06-03 US disclosed
WO-2003031492-A1 THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N HENKEL CORPORATION (US) 2003-04-17 WO disclosed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US disclosed
WO-2002028849-A1 REWORKABLE EPOXIDIZED 1-(CYCLO)ALKENYL ETHER/POLYCARBOXYLIC ACID PRODUCT HENKEL LOCTITE CORPORATION (US) 2002-04-11 WO disclosed
EP-0427561-A2 Method of fabricating bent metal body with resin coating SOMAR CORPORATION (JP) 1991-05-15 EP disclosed
JP-S646019-A CURABLE POLYMER COMPOSITION TORAY INDUSTRIES 1989-01-10 JP disclosed
EP-0262891-A2 Resin composition of thermosetting resin and thermoplastic resin Toho Rayon Co., Ltd. (JP) 1988-04-06 EP disclosed