Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AR | P10275 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 1/20 | 0.32 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | CA7 | P43166 | 1/20 | 0.32 |
| ▸ | CA9 | Q16790 | 1/20 | 0.32 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.32 |
| ▸ | HTR2A | P28223 | 2/20 | 0.32 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.32 |
| ▸ | IRAK4 | Q9NWZ3 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.31 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.31 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.31 |
| ▸ | SGMS2 | Q8NHU3 | 5/20 | 0.31 |
| ▸ | LMNA | P02545 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27228694 | 0.83 | ALDH1A1 (0.33) | ALDH1A1SGMS2LMNA | |
| SCHEMBL7920316 | 0.80 | ALDH1A1 (0.31) | ARHTR2ASLC6A4ALDH1A1SGMS2 | |
| SCHEMBL9419414 | 0.79 | TRPA1 (0.34) | ALDH1A1SGMS2LMNA | |
| SCHEMBL1325513 | 0.79 | GPR84 (0.36) | ACHEALDH1A1SGMS2LMNAPOLB | |
| SCHEMBL7906970 | 0.78 | ALDH1A1 (0.33) | ARCA1CA2ACHECA12 | |
| SCHEMBL159732 | 0.77 | CA1 (0.38) | CA1CA2CA12CA4CA7 | |
| SCHEMBL30159634 | 0.77 | CA1 (0.38) | CA1CA2CA12CA4CA7 | |
| SCHEMBL9303081 | 0.75 | CA1 (0.60) | CA1CA2ACHECA12CA4 | |
| SCHEMBL3459555 | 0.75 | CYP2D6 (0.35) | CA1CA2ACHEMAPK1 | |
| SCHEMBL7917080 | 0.75 | ADRA2A (0.33) | ALDH1A1LMNASMN1; SMN2GAAKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3115416-A1 | THERMOSETTING RESIN COMPOSITION AND USE THEREOF | Shengyi Technology Co., Ltd. (CN) | 2017-01-11 | — | — | EP | claimed |
| US-9193858-B2 | Thermoset resin composition and its use | GUANGDONG SHENGYI SCI. TECH CO., LTD. (CN) | 2015-11-24 | — | — | US | claimed |
| US-20150247015-A1 | THERMOSETTING RESIN COMPOSITION AND ITS USAGE | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2015-09-03 | — | — | US | claimed |
| EP-2121845-B1 | POLYMER FILM FOR SURFACE-COATING COMPOSITE FIBER-PLASTIC MATERIALS | MANKIEWICZ GEBR & CO (DE) | 2013-10-02 | — | — | EP | claimed |
| WO-2024042878-A1 | CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS | 株式会社レゾナック | 2024-02-29 | — | — | WO | disclosed |
| WO-2024024424-A1 | CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS | 株式会社レゾナック | 2024-02-01 | — | — | WO | disclosed |
| WO-2024009908-A1 | METHOD FOR MANUFACTURING AUTOMOBILE STRUCTURAL MATERIAL | 株式会社レゾナック | 2024-01-11 | — | — | WO | disclosed |
| WO-2022080443-A1 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM | 味の素株式会社 | 2022-04-21 | — | — | WO | disclosed |
| CN-107236138-B | Resin sheet | 味之素株式会社 | 2022-02-11 | — | — | CN | disclosed |
| CN-107129589-B | Resin sheet with support | 味之素株式会社 | 2021-07-16 | — | — | CN | disclosed |
| CN-107033515-B | Prepreg | 味之素株式会社 | 2021-03-16 | — | — | CN | disclosed |
| CN-107118515-B | Resin sheet with support | 味之素株式会社 | 2021-01-01 | — | — | CN | disclosed |
| EP-1229079-B1 | Thermosetting resin composition and use thereof | HITACHI CHEMICAL CO LTD (JP) | 2004-09-01 | — | — | EP | disclosed |
| US-6667107-B2 | Heat resistance; waterproofing | HITACHI CHEMICAL CO., LTD. (JP) | 2003-12-23 | — | — | US | disclosed |
| US-20020147277-A1 | Thermosetting resin composition and use thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2002-10-10 | — | — | US | disclosed |
| EP-1229079-A1 | Thermosetting resin composition and use thereof | Hitachi Chemical Co., Ltd. (JP) | 2002-08-07 | — | — | EP | disclosed |
| EP-0686170-A4 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS INC (US) | 1997-05-28 | — | — | EP | disclosed |
| EP-0686170-A1 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS (US) | 1995-12-13 | — | — | EP | disclosed |
| WO-1994019402-A2 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS (US) | 1994-09-01 | — | — | WO | disclosed |
| EP-0544741-A1 | CYANATE ESTER ADHESIVES FOR ELECTRONIC APPLICATIONS. | MINNESOTA MINING & MFG (US) | 1993-06-09 | — | — | EP | disclosed |