SCHEMBL13327255

SCHEMBL13327255

CCCCNC(=O)ON1C(=O)c2cccc3cccc(c23)C1=O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.59
KDM4E B2RXH2 5/20 0.46
MEN1 O00255 4/20 0.46
KMT2A Q03164 4/20 0.46
ALDH1A1 P00352 4/20 0.46
HPGD P15428 2/20 0.46
HSD17B10 Q99714 2/20 0.46
CYP1B1 Q16678 1/20 0.46
MAPT P10636 2/20 0.44
PABPC1 P11940 1/20 0.44
ASAH1 Q13510 1/20 0.44
POLB P06746 2/20 0.43
SIRT1 Q96EB6 1/20 0.43
GAA P10253 1/20 0.43
HTT P42858 1/20 0.43
CYP1A2 P05177 1/20 0.43
AKR1B1 P15121 1/20 0.43
ALOX15 P16050 1/20 0.43
OGA O60502 1/20 0.43
HEXA P06865 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11964043 0.92 TDP1 (0.50) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL17341932 0.83 ASAH1 (0.64) ALDH1A1ASAH1HTT
SCHEMBL12704702 0.82 TDP1 (0.41) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL25760753 0.80 TDP1 (0.63) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL11706176 0.79 ALDH1A1 (0.54) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL2957046 0.79 TDP1 (0.62) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL4311303 0.78 TDP1 (0.60) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL24169113 0.77 TDP1 (0.58) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL2957041 0.76 TDP1 (0.57) TDP1KDM4EMEN1KMT2AALDH1A1
SCHEMBL2959934 0.74 ALDH1A1 (0.64) TDP1KDM4EMEN1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7718343-B2 Decomposable resin composition and pattern-forming material including the same FUJIFILM CORPORATION (JP) 2010-05-18 US disclosed
US-7718343-B2 Decomposable resin composition and pattern-forming material including the same FUJIFILM CORPORATION (JP) 2010-05-18 US disclosed
US-20080070154-A1 DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL INCLUDING THE SAME FUJIFILM CORPORATION (JP) 2008-03-20 US disclosed
US-20080070154-A1 DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL INCLUDING THE SAME FUJIFILM CORPORATION (JP) 2008-03-20 US disclosed