SCHEMBL13344728

SCHEMBL13344728

CCC(C)(C)OC(=O)CCCOC

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
TSHR P16473 5/20 0.37
TDP1 Q9NUW8 1/20 0.34
DGKA P23743 1/20 0.34
RECQL P46063 1/20 0.31
CYP1A2 P05177 1/20 0.31
ENPP2 Q13822 4/20 0.30
MEN1 O00255 1/20 0.30
HPGD P15428 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19821845 0.88 TSHR (0.37) ALDH1A1TSHRTDP1
SCHEMBL19821838 0.82 TSHR (0.60) ALDH1A1TSHRTDP1RECQLMEN1
SCHEMBL6512954 0.82 ALDH1A1 (0.43) ALDH1A1TSHRTDP1DGKARECQL
SCHEMBL11509336 0.82 CES1 (0.42) ALDH1A1TSHRDGKA
SCHEMBL19821831 0.81 ALDH1A1 (0.48) ALDH1A1TSHRDGKACYP1A2
SCHEMBL142215 0.81 TSHR (0.39) ALDH1A1TSHRTDP1
SCHEMBL8162633 0.80 DGKA (0.50) ALDH1A1TSHRDGKA
SCHEMBL107982 0.79 DGKA (0.34) DGKACYP1A2
SCHEMBL12863363 0.79 TSHR (0.36) ALDH1A1TSHRTDP1DGKAMEN1
SCHEMBL19809916 0.78 DGKA (0.53) ALDH1A1TSHRTDP1DGKAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773266-B2 Polymer, molded body, foam, resin composition, and production method for polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-10-03 US disclosed
US-20230129965-A1 HYDROPHILIC AND OLEOPHOBIC POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-27 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
WO-2010067898-A2 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2010-06-17 WO disclosed