SCHEMBL13360852

SCHEMBL13360852

CCOCC(C)(CC)CO

nearest known ligand 0.36

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.36
PDE9A O76083 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18961181 0.90 ALDH1A1 (0.39) ALDH1A1
SCHEMBL10089444 0.90 PDE9A (0.31) PDE9A
SCHEMBL17032004 0.87 PDE9A (0.31) PDE9A
SCHEMBL14070492 0.85 TSHR (0.33) ALDH1A1PDE9A
SCHEMBL10447692 0.84 TSHR (0.33) ALDH1A1
SCHEMBL1561949 0.84 TSHR (0.33) ALDH1A1
SCHEMBL14900631 0.83 ALDH1A1 (0.40) ALDH1A1
SCHEMBL8374391 0.81 ALDH1A1 (0.33) ALDH1A1
SCHEMBL16360840 0.81 LMNA (0.41) ALDH1A1
SCHEMBL14384868 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100108258-A1 HOT-CURING EPOXY RESIN COMPOSITIONS THAT CAN BE USED AS BODYSHELL ADHESIVE OR STRUCTURAL FOAM SIKA TECHNOLOGY AG (CH) 2010-05-06 US disclosed