SCHEMBL134173

SCHEMBL134173

Oc1ccc(C(c2ccc(O)cc2)(C(Cl)(Cl)Cl)C(Cl)(Cl)Cl)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 11/20 0.56
ESR2 Q92731 11/20 0.56
CYP3A4 P08684 3/20 0.48
LMNA P02545 2/20 0.48
TYR P14679 2/20 0.48
HPGD P15428 2/20 0.48
HSD17B10 Q99714 2/20 0.48
TSHR P16473 2/20 0.48
AR P10275 1/20 0.48
SLC6A2 P23975 1/20 0.48
SLC6A4 P31645 1/20 0.48
HTR6 P50406 1/20 0.48
ESRRG P62508 1/20 0.48
SLC6A3 Q01959 1/20 0.48
ALDH1A1 P00352 2/20 0.44
HIF1A Q16665 2/20 0.44
KDM4E B2RXH2 1/20 0.44
MEN1 O00255 1/20 0.44
NPC1 O15118 1/20 0.44
CA12 O43570 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL756505 0.79 ESR1 (0.65) ESR1ESR2CYP3A4LMNATYR
SCHEMBL526434 0.77 ESR1 (0.52) ESR1ESR2CYP3A4LMNATYR
SCHEMBL7157010 0.77 ESR1 (0.52) ESR1ESR2CYP3A4LMNATYR
SCHEMBL756504 0.75 ESR1 (0.74) ESR1ESR2CYP3A4LMNATYR
SCHEMBL10552537 0.75 ESR1 (0.74) ESR1ESR2CYP3A4LMNATYR
SCHEMBL23928387 0.74 ESR1 (0.59) ESR1ESR2CYP3A4LMNATYR
SCHEMBL6018209 0.74 ESR1 (0.59) ESR1ESR2CYP3A4LMNATYR
SCHEMBL136609 0.74 ESR1 (0.56) ESR1ESR2CYP3A4LMNATYR
SCHEMBL28594431 0.74 ESR1 (0.56) ESR1ESR2CYP3A4LMNATYR
SCHEMBL8067180 0.74 ESR1 (0.78) ESR1ESR2CYP3A4LMNATYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110950740-B Synthesis method of hexafluorobisphenol A 湖南有色郴州氟化学有限公司 2022-07-26 CN claimed
US-6077928-A Bis(dialkylmaleimide) derivative and polyetherimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-20 US claimed
CN-120004700-A Preparation method of bisphenol AF 内蒙古氟源科技有限公司 2025-05-16 CN disclosed
US-12104014-B2 Polycarbonate resin composition and molded body of same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-10-01 US disclosed
EP-3798266-B1 POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY OF SAME SUMITOMO CHEMICAL CO (JP) 2024-08-14 EP disclosed
US-11852973-B2 Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device TORAY INDUSTRIES, INC. (JP) 2023-12-26 US disclosed
CN-115485258-A Method for preparing 2, 2-di (3, 4-dimethylphenyl) hexafluoropropane 浙江中欣氟材股份有限公司 2022-12-16 CN disclosed
WO-2022184016-A1 NEW INDUSTRIAL PROCESS FOR MANUFACTURING OF 2, 2-BIS (3, 4-DIMETHYLPHENYL) HEXAFLUOROPROPANE ZHEJIANG ZHONGXIN FLUORIDE MATERIALS CO., LTD. (CN) 2022-09-09 WO disclosed
CN-110950740-B Synthesis method of hexafluorobisphenol A 湖南有色郴州氟化学有限公司 2022-07-26 CN disclosed
CN-110950740-B Synthesis method of hexafluorobisphenol A 湖南有色郴州氟化学有限公司 2022-07-26 CN disclosed
US-20210332166-A1 PHOTOSENSITIVE RESIN COMPOSITION, RESIN SHEET, CURED FILM, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2021-10-28 US disclosed
EP-2006333-A1 THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2008-12-24 EP disclosed
EP-1992663-A1 THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-19 EP disclosed
EP-1970410-A1 AROMATIC POLYCARBONATE RESIN COMPOSITION FOR LIGHTGUIDE PLATE AND LIGHTGUIDE PLATE Mitsubishi Engineering-Plastics Corporation (JP) 2008-09-17 EP disclosed
EP-1925640-A1 RESIN COMPOSITIONS AND RESIN MOLDINGS Mitsubishi Chemical Corporation (JP) 2008-05-28 EP disclosed
US-6762250-B2 TRANSPARENCY, FLUIDITY; CONTAINING POLYSILOXANE HAVING AT LEAST AROMATIC HYDROCARBON FUNCTIONALITY, CARBOXYLIC ACID ESTER AND/OR ETHER LINKAGES AND PHOSPHORIC ESTER GROUP ATTACHMENT MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2004-07-13 US disclosed
US-20040054116-A1 Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION 2004-03-18 US disclosed
US-6077928-A Bis(dialkylmaleimide) derivative and polyetherimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-20 US disclosed
US-6031061-A Bis (triaklyltrimellitic anhydride) derivative and polyesterimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-02-29 US disclosed
US-5776989-A Method of recycling cured unsaturated polyester resin waste WAKAYAMA PREFECTURE (JP) 1998-07-07 US disclosed