SCHEMBL1345773

SCHEMBL1345773

CC(C)c1cc2c(c(C(C)C)c1)Sc1ccccc1C2

nearest known ligand 0.38

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
ALDH1A1 P00352 3/20 0.35
HPGD P15428 3/20 0.35
KDM4E B2RXH2 2/20 0.35
HTT P42858 1/20 0.35
ATM Q13315 1/20 0.35
PTGS2 P35354 1/20 0.35
OPRK1 P41145 1/20 0.35
PDE4D Q08499 1/20 0.35
LMNA P02545 1/20 0.33
MAPT P10636 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
HTR2A P28223 1/20 0.33
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
FABP3 P05413 2/20 0.31
FABP4 P15090 2/20 0.31
FABP5 Q01469 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1514175 0.81 KMT2A (0.45) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL29958208 0.81 KMT2A (0.45) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL170423 0.78 PTGS2 (0.50) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL29670758 0.78 PTGS2 (0.50) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL28373276 0.76 PTGS2 (0.49) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL28256784 0.75 MEN1 (0.34) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL1346929 0.75 MEN1 (0.32) MEN1KMT2AHPGDLMNAGABRA1
SCHEMBL27615611 0.72 MEN1 (0.36) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL12386906 0.70 TSHR (0.42) MEN1KMT2AALDH1A1HPGDKDM4E
SCHEMBL1488973 0.68 HPGD (0.42) MEN1KMT2AALDH1A1HPGDKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240134277-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2024-04-25 US disclosed
CN-109971376-A Cut die bonding film 日东电工株式会社 2019-07-05 CN disclosed
CN-109312040-A The manufacturing method of polyurethane foam piece, its manufacturing method and laminated body DIC株式会社 2019-02-05 CN disclosed
CN-105324689-B Infrared shield piece and its manufacturing method with and application thereof 日本化药株式会社 2018-10-30 CN disclosed
CN-105860778-B Aqueous radiation curable coating decorative panel and preparation method thereof 珠海市佳伟力环保科技有限公司 2018-09-11 CN disclosed
CN-108276412-A Glycoluril class with functional group and its utilization 四国化成工业株式会社 2018-07-13 CN disclosed
CN-105075409-B Solder resist composition and printed wiring board using the same 太阳控股株式会社 2018-07-03 CN disclosed
CN-108164534-A Glycoluril class and its utilization with functional group 四国化成工业株式会社 2018-06-15 CN disclosed
CN-105670471-B Water-based radiation curable coating decorative panel and preparation method thereof 珠海市佳伟力环保科技有限公司 2018-05-15 CN disclosed
CN-106662807-B Liquid solder mask agent composition and coated printed substrate 互应化学工业株式会社 2018-04-06 CN disclosed
US-20080261038-A1 ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES NITTO DENKO CORPORATION (JP) 2008-10-23 US disclosed
EP-1942166-A1 Adhesive sheet for processing semiconductor substrates Nitto Denko Corporation (JP) 2008-07-09 EP disclosed
US-20080160257-A1 Antireflection Hard Coating Film, Optical Element and Image Display NITTO DENKO CORPORATION (JP) 2008-07-03 US disclosed
US-20070178297-A1 Radiation transparent; polyurethanes NITTO DENKO CORPORATION (JP) 2007-08-02 US disclosed
CN-1972995-A Binder resin composition, paste, and green sheet SEKISUI CHEMICAL CO LTD (JP) 2007-05-30 CN disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed
US-6855415-B2 Coated thermoplastic film substrate GENERAL ELECTRIC COMPANY (US) 2005-02-15 US disclosed
US-20020114923-A1 Method for producing textured thermoplastic film GENERAL ELECTRIC CO. 2002-08-22 US disclosed
EP-0916705-A2 Thermoplastic coating compositions GENERAL ELECTRIC COMPANY (US) 1999-05-19 EP disclosed