SCHEMBL1346929

SCHEMBL1346929

CC(C)c1ccc2c(c1)Sc1c(cccc1C(C)C)C2

nearest known ligand 0.32

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
FAAH O00519 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
LMNA P02545 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
GABRA1 P14867 1/20 0.31
HPGD P15428 1/20 0.31
TSHR P16473 1/20 0.31
GABRB1 P18505 1/20 0.31
GABRG2 P18507 1/20 0.31
PTGS1 P23219 1/20 0.31
SLC6A2 P23975 1/20 0.31
HTR2C P28335 1/20 0.31
GABRB3 P28472 1/20 0.31
GABRA5 P31644 1/20 0.31
GABRA3 P34903 1/20 0.31
HTR2B P41595 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29958208 0.83 KMT2A (0.45) MEN1KMT2AFAAHCA1CA2
SCHEMBL1514175 0.83 KMT2A (0.45) MEN1KMT2AFAAHCA1CA2
SCHEMBL1345773 0.75 MEN1 (0.38) MEN1KMT2ALMNAGABRA1HPGD
SCHEMBL170423 0.70 PTGS2 (0.50) MEN1KMT2ALMNACYP1A2CYP3A4
SCHEMBL29670758 0.70 PTGS2 (0.50) MEN1KMT2ALMNACYP1A2CYP3A4
SCHEMBL28373276 0.69 PTGS2 (0.49) MEN1KMT2ALMNACYP1A2CYP3A4
SCHEMBL12386906 0.69 TSHR (0.42) MEN1KMT2ALMNAHPGDTSHR
SCHEMBL1347881 0.66 KMT2A (0.48) MEN1KMT2ALMNACYP1A2HPGD
SCHEMBL2397416 0.66
SCHEMBL4734664 0.66 CYP17A1 (0.39) MEN1KMT2AHPGDHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8063245-B2 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2011-11-22 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed