Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RARB | P10826 | 6/20 | 0.59 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.56 |
| ▸ | MEN1 | O00255 | 1/20 | 0.56 |
| ▸ | RARA | P10276 | 1/20 | 0.56 |
| ▸ | MAPT | P10636 | 1/20 | 0.56 |
| ▸ | MTOR | P42345 | 1/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.56 |
| ▸ | THRA | P10827 | 2/20 | 0.54 |
| ▸ | THRB | P10828 | 2/20 | 0.54 |
| ▸ | LMNA | P02545 | 1/20 | 0.53 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.52 |
| ▸ | BCL2 | P10415 | 1/20 | 0.48 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.47 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.46 |
| ▸ | LPAR5 | Q9H1C0 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9154546 | 0.93 | SIGMAR1 (0.62) | RARBALDH1A1MEN1RARAMAPT | |
| SCHEMBL9638279 | 0.93 | SIGMAR1 (0.62) | RARBALDH1A1MEN1RARAMAPT | |
| SCHEMBL4147899 | 0.93 | SIGMAR1 (0.62) | RARBALDH1A1MEN1RARAMAPT | |
| SCHEMBL83795 | 0.89 | HRH3 (0.58) | RARBALDH1A1MEN1RARAMAPT | |
| Hydrochloric Acid SCHEMBL9315082 | 0.87 | HRH3 (0.56) | RARBALDH1A1MEN1RARAMAPT | |
| SCHEMBL9149170 | 0.85 | HSD17B10 (0.61) | MAPTKMT2ATHRATHRBLMNA | |
| SCHEMBL11451779 | 0.84 | THRA (0.53) | ALDH1A1THRATHRBLMNASIGMAR1 | |
| SCHEMBL11249546 | 0.84 | THRA (0.53) | THRATHRBLMNASIGMAR1KCNH2 | |
| SCHEMBL14558183 | 0.83 | RARB (0.53) | RARBALDH1A1MEN1RARAMAPT | |
| SCHEMBL1348794 | 0.82 | RARB (0.60) | RARBALDH1A1MEN1RARAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-7396898-B2 | Diamine, acid dianhydride, and reactive group containing polyimide composition prepared therefrom and process of preparing them | KANEKA CORPORATION (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7189488-B2 | Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor | KANEKA CORPORATION (JP) | 2007-03-13 | — | — | US | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20040265731-A1 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
| US-20040235992-A1 | Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom | KANEKA CORPORATION (JP) | 2004-11-25 | — | — | US | disclosed |
| EP-0814109-B1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL CO LTD (JP) | 2004-08-18 | — | — | EP | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20030149142-A1 | Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor | KANEKA CORPORATION | 2003-08-07 | — | — | US | disclosed |
| US-20020048726-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-6319656-B1 | FORMING FILM OF A NEGATIVE-WORKING PHOTO-SENSITIVE POLYIMIDE PRECURSOR ON A SUBSTRATE; EXPOSING FILM TO LIGHT THROUGH A MASK HAVING A PREDETERMINED PATTERN; DEVELOPING THE EXPOSED FILM USING AN ALKALINE AQUEOUS SOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6087006-A | SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6025113-A | FOR PREPARING HIGHLY SENSITIVE NEGATIVE-WORKING PHOTOSENSITIVE MATERIAL DEVELOPABLE WITH ALKALINE AQUEOUS SOLUTION IN SHORT TIME WITH HIGH RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0814109-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-12-29 | — | — | EP | disclosed |