SCHEMBL1348417

SCHEMBL1348417

CC(C)(C)c1cc(C(=O)OO)cc(C(=O)OO)c1C(=O)OO

nearest known ligand 0.35

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.35
MAPT P10636 1/20 0.35
GLRA3 O75311 1/20 0.34
GLRB P48167 1/20 0.34
LMNA P02545 1/20 0.33
RECQL P46063 1/20 0.33
NR1H4 Q96RI1 3/20 0.31
ALOX5 P09917 1/20 0.31
PTGS1 P23219 1/20 0.31
PTGS2 P35354 1/20 0.31
HSP90AA1 P07900 1/20 0.30
HSP90AB1 P08238 1/20 0.30
ATM Q13315 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
SERPINE1 P05121 1/20 0.30
TNFRSF1A P19438 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11334616 0.81 CA12 (0.32) POLBMAPTLMNATDP1SERPINE1
SCHEMBL195744 0.77 KDM4E (0.40) POLBMAPTLMNANR1H4ALOX5
SCHEMBL1348680 0.74 POLB (0.32) POLBMAPTGLRA3GLRB
SCHEMBL363479 0.74 MAPT (0.41) POLBMAPTNR1H4ATMTDP1
SCHEMBL195743 0.72 TDP1 (0.44) MAPTGLRA3GLRBNR1H4HSP90AA1
SCHEMBL316065 0.69 POLB (0.35) POLBMAPTGLRA3GLRBNR1H4
SCHEMBL122561 0.69 POLB (0.38) POLBMAPTGLRA3GLRBNR1H4
SCHEMBL18774068 0.69 CA12 (0.32) POLBLMNATDP1SERPINE1
SCHEMBL10707615 0.68 SMN1; SMN2 (0.40) POLBMAPTLMNANR1H4ALOX5
SCHEMBL1323709 0.68 ALOX15 (0.41) POLBMAPTGLRA3GLRBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8063245-B2 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2011-11-22 US disclosed
US-20100218984-A1 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed