Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propylene Glycol SCHEMBL18064606 | 0.83 | TDP1 (0.56) | — | |
| Vinyl Ether SCHEMBL63807 | 0.83 | TDP1 (0.56) | — | |
| SCHEMBL4147194 | 0.80 | TDP1 (0.41) | — | |
| Propylene Glycol SCHEMBL159902 | 0.79 | — | — | |
| Propylene Glycol SCHEMBL4596786 | 0.79 | TDP1 (0.67) | — | |
| Propylene Glycol SCHEMBL28277453 | 0.79 | — | — | |
| Propylene Glycol SCHEMBL3169225 | 0.79 | — | — | |
| Propylene Glycol SCHEMBL2026277 | 0.79 | TDP1 (0.67) | — | |
| Propylene Glycol SCHEMBL8145561 | 0.79 | TDP1 (0.67) | — | |
| Propylene Glycol SCHEMBL21060833 | 0.79 | TDP1 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20160023980-A1 | MONOMERS AND POLYMERS DERIVED FROM NATURAL PHENOLS | NDSU RESEARCH FOUNDATION (US) | 2016-01-28 | — | — | US | claimed |
| EP-3812446-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2023-06-28 | — | — | EP | disclosed |
| CN-110079276-B | Composition for heat cycle system and heat cycle system | ＡＧＣ株式会社 | 2022-01-14 | — | — | CN | disclosed |
| US-11072734-B2 | Composition for heat cycle system, and heat cycle system | AGC Inc. (JP) | 2021-07-27 | — | — | US | disclosed |
| EP-3812446-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC. (JP) | 2021-04-28 | — | — | EP | disclosed |
| EP-3109304-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2021-01-13 | — | — | EP | disclosed |
| EP-3109302-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3109301-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2020-06-03 | — | — | EP | disclosed |
| US-20190316016-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC Inc. (JP) | 2019-10-17 | — | — | US | disclosed |
| US-10392546-B2 | Composition for heat cycle system, and heat cycle system | AGC Inc. (JP) | 2019-08-27 | — | — | US | disclosed |
| WO-2014197041-A2 | MONOMERS AND POLYMERS DERIVED FROM NATURAL PHENOLS | NSDU RESEARCH FOUNDATION (US) | 2014-12-11 | — | — | WO | disclosed |
| US-8859186-B2 | Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition | DAI NIPPON PRINTING CO., LTD. (JP) | 2014-10-14 | — | — | US | disclosed |
| US-20140296444-A1 | MONOMERS AND POLYMERS DERIVED FROM NATURAL PHENOLS | NDSU RESEARCH FOUNDATION (US) | 2014-10-02 | — | — | US | disclosed |
| US-20130230724-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE-MOLDED PRODUCT, AND IMAGE FORMING APPARATUS | FUJI XEROX CO., LTD. (JP) | 2013-09-05 | — | — | US | disclosed |
| US-20110281218-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2011-11-17 | — | — | US | disclosed |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-20090010603-A1 | Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module | NIPPON SHOKUBAI CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| WO-2006038735-A1 | RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE | NIPPON SHOKUBAI CO., LTD. (JP) | 2006-04-13 | — | — | WO | disclosed |
| CN-1454400-A | Polymer solid electrolyte and battery using the same | DAINIPPON INK & CHEMICALS (JP) | 2003-11-05 | — | — | CN | disclosed |
| EP-1339127-A1 | SOLID POLYMER ELECTROLYTE AND CELL CONTAINING THE ELECTROLYTE | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2003-08-27 | — | — | EP | disclosed |