SCHEMBL1363721

SCHEMBL1363721

CCO[Si](CCCN)(OCC)OC(C)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28482451 0.88
SCHEMBL189449 0.88
SCHEMBL14335743 0.87
SCHEMBL920285 0.85 CYP3A4 (0.33)
SCHEMBL2354408 0.85 CPB2 (0.34)
SCHEMBL27815728 0.84
SCHEMBL28019056 0.83 GABRP (0.30)
SCHEMBL14359834 0.83
SCHEMBL1674585 0.83
SCHEMBL28177343 0.83 OPRM1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119463773-A Epoxy adhesive and preparation method and application thereof 韦尔通科技股份有限公司 2025-02-18 CN claimed
CN-119463772-A Electrically-detachable epoxy resin adhesive and preparation method and application thereof 韦尔通科技股份有限公司 2025-02-18 CN claimed
CN-118185532-B High-adhesive-strength epoxy adhesive capable of being rapidly cured at room temperature and preparation method thereof 佛山禾邦新材料科技有限公司 2024-09-17 CN claimed
CN-118546613-A Ultraviolet-reinforced solvent-free acrylic pressure-sensitive ultraviolet-reinforced structural adhesive and preparation method thereof 清丞新材料科技(上海)有限公司 2024-08-27 CN claimed
CN-118185532-A High-adhesive-strength epoxy adhesive capable of being rapidly cured at room temperature and preparation method thereof 佛山禾邦新材料科技有限公司 2024-06-14 CN claimed
CN-117229718-A Moisture-enhanced solvent-free acrylic pressure-sensitive moisture-enhanced structural adhesive and preparation method thereof 清丞新材料科技(上海)有限公司 2023-12-15 CN claimed
CN-117004357-A Underfill composition, preparation method and application thereof 长沙先进电子材料工业技术研究院有限公司 2023-11-07 CN claimed
CN-114250051-B Epoxy resin underfill adhesive and preparation method and application thereof 韦尔通科技股份有限公司 2023-05-30 CN claimed
CN-114250051-A Epoxy resin bottom filling adhesive and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2022-03-29 CN claimed
CN-114058306-A Underfill adhesive and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2022-02-18 CN claimed
CN-109021902-B Bio-based degradable epoxy resin adhesive and preparation method thereof 扬州市文祺材料有限公司 2021-03-19 CN claimed
CN-109021902-A A kind of degradable epoxy resin adhesive of biology base and preparation method thereof 扬州市文祺材料有限公司 2018-12-18 CN claimed
CN-103025784-A Film-forming compositions and methods for personal care DONG SHAOSHENG 2013-04-03 CN claimed
CN-101208460-B Method and agent for chemical conversion treatment and chemically conversion-treated members HONDA MOTOR CO LTD 2010-05-26 CN claimed
CN-101263191-A Silylamine modified nanoparticulate carriers CARESTREAM HEALTH INC (US) 2008-09-10 CN claimed
CN-101208196-A Polymer interlayers comprising poly(cyclohexanedimethylene terephthalate-co-ethylene terephthalate) copolyester SOLUTIA INC (US) 2008-06-25 CN claimed
CN-1291777-C Positive charged organic-inorganic hybrid membrane preparing method USTC UNIV SCIENCE TECH CN (CN) 2006-12-27 CN claimed
US-20020090738-A1 System and method of microdispensing and arrays of biolayers provided by same I-STAT CORPORATION 2002-07-11 US claimed
CN-120192705-A Aqueous urethane resin composition, coating agent, and article DIC株式会社 2025-06-24 CN disclosed
US-4164485-A NEOPRENE BUTADIENE-STYRENE-VINYLPYRIDINE TERPOLYMER, RESORCINOL, FORMALDEHYDE, WATER PPG INDUSTRIES, INC. (US) 1979-08-14 US disclosed