SCHEMBL136404

SCHEMBL136404

COC(=O)c1ccc(N)c(C)c1C

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.55
HSD17B10 Q99714 3/20 0.55
CFTR P13569 2/20 0.55
GAA P10253 6/20 0.55
KDM4E B2RXH2 6/20 0.55
GLA P06280 3/20 0.55
MAPT P10636 2/20 0.55
HPGD P15428 2/20 0.55
CASP1 P29466 1/20 0.55
CASP7 P55210 1/20 0.55
ATM Q13315 1/20 0.55
ABL1 P00519 1/20 0.53
TSHR P16473 3/20 0.51
ALOX15 P16050 1/20 0.51
PTGER4 P35408 1/20 0.48
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA9 Q16790 2/20 0.44
CA12 O43570 1/20 0.44
CA7 P43166 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3422644 0.87 CA12 (0.54) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL2426826 0.86 PTGER4 (0.54) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL27796104 0.85 ALDH1A1 (0.52) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL772841 0.85 ALDH1A1 (0.52) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL1578948 0.83 ABL1 (0.57) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL16077594 0.83 ALDH1A1 (0.54) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL17596161 0.83 GAA (0.50) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL4387642 0.83 GAA (0.50) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL543352 0.82 ALDH1A1 (0.69) ALDH1A1HSD17B10CFTRGAAKDM4E
SCHEMBL31303445 0.82 ALDH1A1 (0.69) ALDH1A1HSD17B10CFTRGAAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023180035-A1 LOW-TEMPERATURE-CURING COMPOUNDS BASED ON GLYCIDYL ETHERS DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2023-09-28 WO disclosed
CN-112135846-B Polymerizable composition, ink for inkjet, heat-resistant soluble member, three-dimensional structure, and method for producing three-dimensional structure 捷恩智株式会社 2022-08-23 CN disclosed
WO-2021083632-A1 COMPOSITION CURABLE CATIONICALLY IN A MOISTURE-INDUCED MANNER, USE OF THE COMPOSITION AND METHOD OF JOINING, ENCAPSULATING AND COATING SUBSTRATES DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2021-05-06 WO disclosed
CN-112119101-A Polymerizable composition, ink, transfer mold, and method for producing electrode member 捷恩智株式会社 2020-12-22 CN disclosed
CN-110087630-A Rodlike external preparation for skin solid substrate 日产化学株式会社 2019-08-02 CN disclosed
US-10253156-B2 Process for producing dispersion of fine inorganic particles, curable composition containing said dispersion, and cured object obtained therefrom DIC CORPORATION (JP) 2019-04-09 US disclosed
CN-108350012-A New sugar derivatives gelling agent 国立大学法人九州大学 2018-07-31 CN disclosed
CN-107735107-A Stick-shaped base material containing lipid peptide type compound 日产化学工业株式会社 2018-02-23 CN disclosed
US-20170342234-A1 PROCESS FOR PRODUCING DISPERSION OF FINE INORGANIC PARTICLES, CURABLE COMPOSITION CONTAINING SAID DISPERSION, AND CURED OBJECT OBTAINED THEREFROM DIC CORPORATION (JP) 2017-11-30 US disclosed
CN-106569389-A Self-luminescent photosensitive resin composition, color filter and image display device including the color filter 东友精细化工有限公司 2017-04-19 CN disclosed
US-20160326410-A1 SEALER FOR SEALING COVERED-WIRE JSR CORPORATION (JP) 2016-11-10 US disclosed
EP-2432092-B1 KIT FOR ELECTRICAL WIRE WATER-SEALING MATERIAL, ELECTRICAL WIRE WATER-SEALING MATERIAL, WATER-SEALING MEMBER, WATER-SEALED ELECTRICAL WIRE, AND WATER-SEALING METHOD JSR CORP (JP) 2016-05-04 EP disclosed
CN-102617580-B Vasopressin v1a antagonists VANTIA LTD 2015-03-04 CN disclosed
EP-2432092-A1 KIT FOR ELECTRICAL WIRE WATER-SEALING MATERIAL, ELECTRICAL WIRE WATER-SEALING MATERIAL, WATER-SEALING MEMBER, WATER-SEALED ELECTRICAL WIRE, AND WATER-SEALING METHOD JSR Corporation (JP) 2012-03-21 EP disclosed
US-20120055693-A1 KIT FOR PREPARING WATER-SEALING MATERIAL FOR ELECTRICAL WIRE, WATER-SEALING MATERIAL FOR ELECTRICAL WIRE, WATER-SEALING MEMBER, WATER-SEALED ELECTRICAL WIRE, AND WATER-SEALING METHOD JSR CORPORATION (JP) 2012-03-08 US disclosed
EP-1350816-B1 ACTIVE ENERGY RAY CURABLE COMPOSITION FOR COATING OPTICAL DISK AND OPTICAL DISK MITSUBISHI RAYON CO (JP) 2010-06-02 EP disclosed
WO-2009108056-A1 OPTICAL FIBER TAPE WITH EPOXY MODIFIED SILICONE ADDITIVE DSM IP ASSETS B.V. (NL) 2009-09-03 WO disclosed
WO-1997014737-A1 LIQUID CURABLE RESIN COMPOSITION DSM N.V. (NL) 1997-04-24 WO disclosed