SCHEMBL136584

SCHEMBL136584

COc1cccc(N2C(=O)C=CC2=O)c1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 1.00
FAAH O00519 4/20 0.67
HSP90AA1 P07900 3/20 0.61
MAPT P10636 2/20 0.55
ALDH1A1 P00352 1/20 0.55
PKM P14618 1/20 0.55
HTT P42858 1/20 0.55
ATM Q13315 1/20 0.55
G6PD P11413 1/20 0.54
TLR9 Q9NR96 1/20 0.54
CYP1A2 P05177 1/20 0.53
HPN P05981 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29827199 1.00 MGLL (1.00) MGLLFAAHHSP90AA1MAPTALDH1A1
SCHEMBL2120164 0.84 MGLL (0.72) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29353079 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4459418 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL331661 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29352936 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30104191 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL332317 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1271670 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4459406 0.82 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 518 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110724154-A Polysubstituted pyrrolo [3,4-d ] isoxazole derivative and synthetic method thereof 湖北科技学院 2020-01-24 CN claimed
US-10453420-B2 Base film, laminated structure including the same, and display device LG CHEM, LTD. (KR) 2019-10-22 US claimed
US-20150299841-A1 BASE FILM, LAMINATED STRUCTURE INCLUDING THE SAME, AND DISPLAY DEVICE LG CHEM, LTD. (KR) 2015-10-22 US claimed
CN-104871118-A BASE FILM, AND LAMINATED STRUCTURE AND DISPLAY DEVICE COMPRISING SAME LG CHEMICAL LTD 2015-08-26 CN claimed
US-9075305-B2 Photosensitive resin composition for color filters and uses thereof CHI MEI CORPORATION (TW) 2015-07-07 US claimed
CN-103756315-A Thermosetting resin composition and applications thereof HUAWEI TECH CO LTD 2014-04-30 CN claimed
CN-103509151-A Alkali soluble resin and photosensitive resin composition containing the same DONGWOO FINE CHEM CO LTD 2014-01-15 CN claimed
CN-101370866-B Thermosetting resin composition for semi-IPN composite, and varnish, prepreg and metal-clad laminate using same HITACHI CHEMICAL CO LTD 2013-07-17 CN claimed
CN-101821352-B Adhesive and connection structure using same HITACHI CHEMICAL CO LTD 2013-06-19 CN claimed
CN-101668806-B Method for producing resin varnish containing semi-IPN composite thermosetting resin, and resin varnish for printed wiring board, prepreg, and metal-clad laminate using same HITACHI CHEMICAL CO LTD 2013-06-19 CN claimed
US-20120004341-A1 ALKALI SOLUBLE RESIN POLYMER AND NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME LG CHEM, LTD. (KR) 2012-01-05 US claimed
EP-2091531-B1 PHENYL SUBSTITUTED MALEIMIDES AS MEDICAMENTS FOR BLOCKING DEGENERATIVE TISSUE DAMAGES BY INHIBITING MPT CONGENIA S R L (IT) 2010-11-24 EP claimed
US-7825188-B2 Thermoplastic elastomer with acyloxyphenyl hard block segment DESIGNER MOLECULES, INC. (US) 2010-11-02 US claimed
CN-101668806-A Method for producing resin varnish containing semi-IPN composite thermosetting resin, and resin varnish for printed wiring board, prepreg, and metal-clad laminate using same HITACHI CHEMICAL CO LTD 2010-03-10 CN claimed
CN-101370866-A Thermosetting resin composition for semi-IPN composite, and varnish, prepreg and metal-clad laminate using same HITACHI CHEMICAL CO LTD (JP) 2009-02-18 CN claimed
WO-2008077141-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2008-06-26 WO claimed
US-20080146738-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. 2008-06-19 US claimed
EP-0202498-B1 USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD HITACHI, LTD. (JP) 1990-07-11 EP claimed
EP-0202498-A2 Use of a thermo-setting, polymerizable composition and wiring board HITACHI, LTD. (JP) 1986-11-26 EP claimed
US-4204047-A AN AROMTIC POLYCARBONATE, POLYMERS OF SYTRENE AND/OR METHYL METHACRYLATE AND AN ACRYLONITRILE GRAFTED ON RUBBER AND WITH AN N-SUBSTITUTED MALEIMIDE BAYER AKTIENGESELLSCHAFT (DE) 1980-05-20 US claimed