SCHEMBL1373328

SCHEMBL1373328

CC1(C(=O)c2ccccc2)C=CC(C(=O)C2C=CC(C)(C(=O)c3ccccc3)C=C2)C=C1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.38
TSHR P16473 6/20 0.35
CES2 O00748 5/20 0.35
CES1 P23141 5/20 0.35
DAO P14920 1/20 0.35
NAPRT Q6XQN6 1/20 0.35
ALDH1A1 P00352 1/20 0.35
MAPK1 P28482 1/20 0.34
GAA P10253 1/20 0.34
KMT2A Q03164 2/20 0.33
CYP3A4 P08684 2/20 0.33
POLB P06746 1/20 0.33
PARP1 P09874 1/20 0.33
MAPT P10636 1/20 0.33
CYP2C19 P33261 1/20 0.33
RECQL P46063 1/20 0.33
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
HSD17B10 Q99714 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5320069 0.81 LMNA (0.37) LMNATSHRCES2CES1DAO
SCHEMBL28460482 0.74 LMNA (0.40) LMNATSHRCES2CES1DAO
SCHEMBL28400210 0.73 LMNA (0.39) LMNATSHRCES2CES1DAO
SCHEMBL2470208 0.70 EPHX1 (0.43) TSHRCES2CES1DAONAPRT
SCHEMBL5677227 0.69 CES2 (0.41) TSHRCES2CES1DAONAPRT
SCHEMBL7420069 0.68 HTT (0.40) TSHRCES2CES1DAONAPRT
Hydrochloric Acid SCHEMBL8844129 0.67 HTT (0.39) TSHRCES2CES1DAONAPRT
SCHEMBL10702918 0.66 HTT (0.41) LMNATSHRCES2CES1DAO
SCHEMBL29285327 0.66 LMNA (0.39) LMNATSHRCES2CES1DAO
SCHEMBL8151048 0.65 LMNA (0.48) LMNATSHRCES2CES1DAO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368641-B Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component 东丽株式会社 2025-05-02 CN disclosed
WO-2024237532-A1 PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, AND SEMICONDUCTOR DEVICE 주식회사 엘지화학 2024-11-21 WO disclosed
WO-2024203435-A1 METHOD FOR PRODUCING TRANSFER LAMINATE, TRANSFER LAMINATE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 東レ株式会社 2024-10-03 WO disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
CN-116802559-A Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound 东丽株式会社 2023-09-22 CN disclosed
EP-3284771-B1 HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT TORAY INDUSTRIES (JP) 2023-08-30 EP disclosed
CN-116323755-A Resin composition, cured film, insulating film or protective film, antenna element, electronic component, display device or semiconductor device, and method for producing same 东丽株式会社 2023-06-23 CN disclosed
CN-109716491-B Method for manufacturing field effect transistor and method for manufacturing wireless communication device 东丽株式会社 2023-06-09 CN disclosed
US-20230112804-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2023-04-13 US disclosed
CN-115210648-A Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device 东丽株式会社 2022-10-18 CN disclosed
US-8492450-B2 Siloxane resin composition and protective film for touch panel using the same TORAY INDUSTRIES, INC. (JP) 2013-07-23 US disclosed
US-20110284855-A1 RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2011-11-24 US disclosed
US-20110230584-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING THE SAME TORAY INDUSTRIES, INC. (JP) 2011-09-22 US disclosed
EP-2360194-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING SAME Toray Industries, Inc. (JP) 2011-08-24 EP disclosed
US-7411780-B2 Paste, display member, and process for production of display member TORAY INDUSTRIES, INC. (JP) 2008-08-12 US disclosed
EP-1158019-B1 Paste, display member, and process for production of display member TORAY INDUSTRIES (JP) 2007-12-26 EP disclosed
US-7004812-B2 Paste, display member, and process for production of display member TORAY INDUSTRIES, INC. (JP) 2006-02-28 US disclosed
US-20050079447-A1 Paste, display member, and process for production of display member TORAY INDUSTRIES, INC. (JP) 2005-04-14 US disclosed
US-20020008470-A1 Paste, display member, and process for production of display member TORAY INDUSTRIES INC. (JP) 2002-01-24 US disclosed
EP-1158019-A2 Paste, display member, and process for production of display member TORAY INDUSTRIES, INC. (JP) 2001-11-28 EP disclosed