SCHEMBL13742201

SCHEMBL13742201

Cc1ccc(/C=C/c2ncnc(C(Cl)(Cl)Cl)n2)o1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BRAF P15056 1/20 0.41
MAPT P10636 11/20 0.38
ALDH1A1 P00352 11/20 0.38
KDM4E B2RXH2 9/20 0.38
SMN1; SMN2 Q16637 6/20 0.38
KMT2A Q03164 5/20 0.38
HTT P42858 5/20 0.38
RAB9A P51151 5/20 0.38
MEN1 O00255 4/20 0.38
NPC1 O15118 4/20 0.38
LMNA P02545 2/20 0.38
NFKB1 P19838 1/20 0.38
NFKB2 Q00653 1/20 0.38
RELA Q04206 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
PKM P14618 4/20 0.33
HPGD P15428 5/20 0.32
BLM P54132 2/20 0.32
L3MBTL1 Q9Y468 2/20 0.32
MAOA P21397 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5188282 1.00 BRAF (0.41) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL25422554 0.85 BRAF (0.47) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL498610 0.85 BRAF (0.47) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL498611 0.85 BRAF (0.47) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL5187607 0.82 CYP1A2 (0.34)
SCHEMBL19320476 0.81 BRAF (0.44) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL30724511 0.77 BRAF (0.40) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL13883530 0.76 BRAF (0.40) BRAFMAPTALDH1A1KDM4ESMN1; SMN2
SCHEMBL21603035 0.75 GRM4 (0.46) MAPTALDH1A1KDM4ESMN1; SMN2KMT2A
SCHEMBL17122503 0.75 BRAF (0.42) BRAFMAPTALDH1A1KDM4ESMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9519216-B2 Positive photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2016-12-13 US disclosed
US-9519216-B2 Positive photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2016-12-13 US disclosed
US-20090197067-A1 Novel Positive Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-06 US disclosed
US-20090197067-A1 Novel Positive Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-06 US disclosed