SCHEMBL13776397

SCHEMBL13776397

O=C(CCCCCOC(=O)C1CC2OC2CC1C(=O)OCCCCCC(=O)OCC1CCC2OC2C1)OCC1CCC2OC2C1

nearest known ligand 0.36

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.34
POLB P06746 1/20 0.34
EPHX2 P34913 6/20 0.33
PRKCA P17252 2/20 0.33
DGKA P23743 1/20 0.33
LPAR1 Q92633 2/20 0.33
LPAR3 Q9UBY5 2/20 0.33
PPM1B O75688 1/20 0.33
PTPN1 P18031 1/20 0.33
PPP1CC P36873 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14417647 1.00 LMNA (0.34) LMNAPOLBEPHX2PRKCADGKA
SCHEMBL10297365 0.99 LMNA (0.33) LMNAPOLBEPHX2PRKCADGKA
SCHEMBL12993915 0.92 PRKCA (0.30) PRKCA
SCHEMBL10155842 0.90
SCHEMBL681607 0.90 LMNA (0.33) LMNAPOLBEPHX2PRKCADGKA
SCHEMBL10171015 0.90 LMNA (0.33) LMNAPOLBEPHX2PRKCADGKA
SCHEMBL14372210 0.89
SCHEMBL23781846 0.89 LMNA (0.41) LMNAPOLBDGKALPAR1LPAR3
SCHEMBL30730430 0.89 LMNA (0.41) LMNAPOLBDGKALPAR1LPAR3
SCHEMBL25221602 0.89 LMNA (0.41) LMNAPOLBDGKALPAR1LPAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230331888-A1 Resin Composition NIPPON SHOKUBAI CO., LTD. (JP) 2023-10-19 US disclosed
US-20170096522-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME DAICEL CORPORATION (JP) 2017-04-06 US disclosed
US-9184355-B2 Curable resin composition for reflection of light, and optical semiconductor device DAICEL CORPORATION (JP) 2015-11-10 US disclosed
US-9134617-B2 Solvent developable negative resist composition, resist pattern formation method, and method for forming pattern of layer including block copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-15 US disclosed
US-20140113236-A1 SOLVENT DEVELOPABLE NEGATIVE RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND METHOD FOR FORMING PATTERN OF LAYER INCLUDING BLOCK COPOLYMER RIKEN (JP) 2014-04-24 US disclosed
US-8409715-B2 Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent DIC CORPORATION (JP) 2013-04-02 US disclosed
US-20090181263-A1 Cation-Polymerizable Resin Composition Containing Multi-Branched Polyether Polyol, Adhesive Agent Comprising the Composition, and Laminate and Polarizing Plate Using the Adhesive Agent DIC CORPORATION (JP) 2009-07-16 US disclosed
US-20080285133-A1 Antireflection Film, Production Method Thereof, Polarizing Plate Using the Antireflection Film and Image Display Device Using the Antireflection Film or Polarizing Plate FUJIFILM CORPORATION (JP) 2008-11-20 US disclosed
US-20080038672-A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2008-02-14 US disclosed