Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP19A1 | P11511 | 1/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.35 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
| ▸ | CSNK2A1 | P68400 | 2/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.34 |
| ▸ | PDE4A | P27815 | 1/20 | 0.33 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.33 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.33 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 4/20 | 0.33 |
| ▸ | GAA | P10253 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | HTT | P42858 | 2/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL28108009 | 0.98 | CYP19A1 (0.40) | CYP19A1KDM4EHIF1ANPSR1CSNK2A1 | |
| SCHEMBL11002771 | 0.91 | PDE4A (0.39) | CYP19A1KDM4EHIF1ANPSR1KMT2A | |
| SCHEMBL11286963 | 0.87 | PDE4A (0.35) | CYP19A1KDM4EHIF1ANPSR1CSNK2A1 | |
| Imidazole SCHEMBL21294097 | 0.86 | ALDH1A1 (0.33) | CYP19A1KDM4EHIF1ANPSR1ALDH1A1 | |
| SCHEMBL3686291 | 0.82 | CYP19A1 (0.42) | CYP19A1CSNK2A1KMT2ATSHRGAA | |
| SCHEMBL10867322 | 0.82 | SPNS2 (0.36) | CYP19A1KDM4EHIF1ANPSR1PDE4A | |
| SCHEMBL543250 | 0.80 | CSNK2A1 (0.39) | KDM4EHIF1ANPSR1CSNK2A1KMT2A | |
| SCHEMBL9645498 | 0.80 | CYP19A1 (0.45) | CYP19A1KMT2ATSHRGAALMNA | |
| SCHEMBL444180 | 0.79 | CYP19A1 (0.41) | CYP19A1KDM4EKMT2APDE4APDE4B | |
| SCHEMBL29389456 | 0.79 | CYP19A1 (0.41) | CYP19A1KDM4EKMT2APDE4APDE4B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 7664 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119193064-B | Comb type poly (arylene ether nitrile) modified epoxy resin adhesive and preparation method thereof | 黑龙江省科学院石油化学研究院 | 2026-05-12 | — | — | CN | claimed |
| CN-122011991-A | Single-component epoxy conductive adhesive material and preparation method and application thereof | 深圳市飞荣达科技股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| WO-2025261826-A1 | FILTER CARTRIDGE, FILTER MODULE AND METHOD FOR PRODUCING A GAS FILTER MEMBRANE | EVONIK OPERATIONS GMBH (DE) | 2025-12-26 | — | — | WO | claimed |
| US-12459193-B2 | Method and kit for non-destructive in situ repair (relining) of deteriorated pipelines | APPLIED RESIN S L (ES) | 2025-11-04 | — | — | US | claimed |
| EP-4613790-A1 | HIGH PERFORMANCE SULPHUR-ENRICHED POLYMERS AND COMPOSITES THEREOF | EMPA (CH) | 2025-09-10 | — | — | EP | claimed |
| US-20250277138-A1 | LAYER-ADDING ADHESIVE FILM CONTAINING MODIFIED BENZOCYCLOBUTENE FOR FC-BGA PACKAGE CARRIER, PREPARATION METHOD, AND APPLICATION THEREOF | Shenzhen Newccess Industrial Co., Ltd. (CN) | 2025-09-04 | — | — | US | claimed |
| CN-120118480-A | Degradable epoxy resin composite material with adjustable curing speed and preparation and moderate full recycling methods thereof | 哈尔滨工业大学 | 2025-06-10 | — | — | CN | claimed |
| CN-120040910-A | Epoxy resin composition, epoxy resin adhesive and application | 杭州之江有机硅化工有限公司 | 2025-05-27 | — | — | CN | claimed |
| US-20250163261-A1 | LOW-DIELECTRIC RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2025-05-22 | — | — | US | claimed |
| CN-119859370-A | Cycloolefin resin composition and composite material thereof | 道生天合材料科技(上海)股份有限公司 | 2025-04-22 | — | — | CN | claimed |
| US-5043102-A | Blend of epoxy resin, unsaturated monomer, free radical catalyst, and silver particles | ADVANCED PRODUCTS, INC. (US) | 1991-08-27 | — | — | US | claimed |
| WO-1991008575-A1 | CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE | ADVANCED PRODUCTS, INC. (US) | 1991-06-13 | — | — | WO | claimed |
| CN-1040211-A | LOW VISCOSITY EPOXY RESIN COMPOSITIONS | GEN ELECTRIC (US) | 1990-03-07 | — | — | CN | claimed |
| US-4906711-A | Low viscosity epoxy resin compositions | GENERAL ELECTRIC COMPANY (US) | 1990-03-06 | — | — | US | claimed |
| EP-0353103-A2 | Low viscosity epoxy resin compositions | GENERAL ELECTRIC COMPANY (US) | 1990-01-31 | — | — | EP | claimed |
| US-4658009-A | Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-04-14 | — | — | US | claimed |
| US-4370467-A | CYANATE, PEROXIDE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 1983-01-25 | — | — | US | claimed |
| US-4110364-A | AND BISMALEIIMIDES | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 1978-08-29 | — | — | US | claimed |
| US-4100118-A | POLYGLYCIDYL ESTER OF A FATTY ACID, ISOCYANATE COMPOUND AND CURING CATALYST, THERMAL RESISTANCE, THERMAL SHOCK RESISTANCE | HITACHI, LTD. (JP) | 1978-07-11 | — | — | US | claimed |
| US-4026872-A | PHENOLIC CURING AGENTS | HITACHI, LTD. (JA) | 1977-05-31 | — | — | US | claimed |