SCHEMBL3686291

SCHEMBL3686291

CCc1nc(C)cn1CC#N

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.42
SMN1; SMN2 Q16637 4/20 0.33
TSHR P16473 3/20 0.33
LMNA P02545 3/20 0.33
HTT P42858 3/20 0.33
MAPT P10636 2/20 0.33
PDE10A Q9Y233 1/20 0.32
ALDH1A1 P00352 1/20 0.31
CSNK2A1 P68400 2/20 0.31
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30
ADORA2B P29275 1/20 0.30
MAPK1 P28482 1/20 0.30
PDE2A O00408 1/20 0.30
PDE1A P54750 1/20 0.30
PDE1B Q01064 1/20 0.30
PDE3B Q13370 1/20 0.30
PDE1C Q14123 1/20 0.30
PDE3A Q14432 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL138437 0.82 CYP19A1 (0.40) CYP19A1SMN1; SMN2TSHRLMNAHTT
Ammonia Solution, Strong SCHEMBL28108009 0.81 CYP19A1 (0.40) CYP19A1SMN1; SMN2TSHRLMNAHTT
SCHEMBL6855316 0.78 CYP19A1 (0.47) CYP19A1SMN1; SMN2TSHRLMNAHTT
SCHEMBL27722877 0.77 CYP19A1 (0.43) CYP19A1SMN1; SMN2TSHRLMNAHTT
SCHEMBL11002771 0.75 PDE4A (0.39) CYP19A1LMNAALDH1A1KMT2AMAPK1
SCHEMBL9645498 0.75 CYP19A1 (0.45) CYP19A1SMN1; SMN2TSHRLMNAHTT
SCHEMBL27850120 0.75 CYP19A1 (0.45) CYP19A1SMN1; SMN2TSHRLMNAHTT
Imidazole SCHEMBL21294097 0.74 ALDH1A1 (0.33) CYP19A1ALDH1A1
SCHEMBL2458279 0.73 SMN1; SMN2 (0.35) CYP19A1SMN1; SMN2TSHRLMNAHTT
SCHEMBL585669 0.72 CYP19A1 (0.43) CYP19A1SMN1; SMN2TSHRLMNAHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119096332-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-12-06 CN disclosed
CN-119096327-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-12-06 CN disclosed
CN-119096330-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-12-06 CN disclosed
CN-119096329-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-12-06 CN disclosed
CN-114466899-B Composite sheet and method for producing same, and laminate and method for producing same 电化株式会社 2024-11-12 CN disclosed
CN-118251448-A Thermosetting composition, cured product thereof, photo-fusible composition, and method for producing structure 株式会社力森诺科 2024-06-25 CN disclosed
CN-115298150-B Boron nitride sintered body and method for producing same, and composite and method for producing same 电化株式会社 2024-02-09 CN disclosed
CN-117063621-A Method for manufacturing circuit board and circuit board 电化株式会社 2023-11-14 CN disclosed
CN-116261782-A Composite sheet and method for producing same, and laminate and method for producing same 电化株式会社 2023-06-13 CN disclosed
CN-116234770-A Boron carbonitride powder and method for producing same, powder composition, boron nitride sintered body and method for producing same, composite body and method for producing same 电化株式会社 2023-06-06 CN disclosed
CN-101522810-A Reinforcement and cure enhancement of curable resins HENKEL CORP (US) 2009-09-02 CN disclosed
US-20060014844-A1 Curable foam elasomeric compositions HENKEL LOCTITE CORPORATION 2006-01-19 US disclosed
WO-2003087204-A9 CURABLE FOAM ELASTOMERIC COMPOSITIONS HENKEL CORP (US) 2004-02-26 WO disclosed
WO-2003087204-A1 CURABLE FOAM ELASTOMERIC COMPOSITIONS HENKEL CORPORATION (US) 2003-10-23 WO disclosed
EP-0642416-B1 FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION LOCTITE CORP (US) 2003-10-01 EP disclosed
WO-2003028070-A2 COMPOSITIONS HAVING CONTROLLED FLOWABILITY AND THERMAL PROPERTIES HENKEL CORPORATION (US) 2003-04-03 WO disclosed
WO-2001028771-A1 MICROWAVE CURABLE COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-26 WO disclosed
US-5679719-A APPLYING TO A FIBER A RESIN CONSISTING OF EPOXY COMPONENT CONTAINING ATLEAST ONE POLYEPOXIDE CURABLE BY HEAT, AN OLEFINICALLY UNSATURATED MONOMER CURABLE BY ACTINIC RADIATION, PHOTOINITIATOR AND ORGANIC PEROXIDE, CURING LOCTITE CORPORATION (US) 1997-10-21 US disclosed
US-5585414-A HEAT CURABLE POLYEPOXIDE, ACTINIC RADIATION CURABLE UNSATURATED MONOMER, PHOTOINITIATOR, HEAT ACTIVATED ORGANIC PEROXIDE, HEAT ACTIVATED AMINE CURING AGENT FOR EPOXY COMPONENT; NONDRIPPING LOCTITE CORPORATION (US) 1996-12-17 US disclosed
US-5565499-A DUAL CURING: AN EPOXY COMPONENT CURABLE BY HEAT AND AN OLEFINICALLY UNSATURATED MONOMER CURABLE BY ACTINIC RADIATION LOCTITE CORPORATION (US) 1996-10-15 US disclosed