Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B1 | P14061 | 17/20 | 0.56 |
| ▸ | HSD17B2 | P37059 | 17/20 | 0.56 |
| ▸ | CYP1A2 | P05177 | 7/20 | 0.56 |
| ▸ | CYP3A4 | P08684 | 7/20 | 0.56 |
| ▸ | CYP2C9 | P11712 | 7/20 | 0.56 |
| ▸ | CYP2C19 | P33261 | 7/20 | 0.56 |
| ▸ | CYP2D6 | P10635 | 6/20 | 0.56 |
| ▸ | CYP2B6 | P20813 | 5/20 | 0.56 |
| ▸ | ESR1 | P03372 | 4/20 | 0.45 |
| ▸ | ESR2 | Q92731 | 4/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13871476 | 0.97 | HSD17B1 (0.54) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL13871466 | 0.97 | HSD17B1 (0.54) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL13871465 | 0.90 | HSD17B1 (0.50) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL13871469 | 0.87 | HSD17B1 (0.47) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL13871471 | 0.87 | HSD17B1 (0.47) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL13871467 | 0.86 | HSD17B1 (0.46) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL31411927 | 0.77 | HSD17B1 (0.73) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL20169571 | 0.74 | ALOX5 (0.50) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL3012675 | 0.72 | HSD17B1 (1.00) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL31545504 | 0.72 | HSD17B1 (0.61) | HSD17B1HSD17B2CYP1A2CYP3A4CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8729192-B2 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material | DIC CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| US-8729192-B2 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material | DIC CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| US-20090099303-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, NOVEL EPOXY RESIN, NOVEL PHENOL RESIN AND SEMICONDUCTOR-ENCAPSULATING MATERIAL | DIC CORPORATION (JP) | 2009-04-16 | — | — | US | disclosed |
| US-20090099303-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, NOVEL EPOXY RESIN, NOVEL PHENOL RESIN AND SEMICONDUCTOR-ENCAPSULATING MATERIAL | DIC CORPORATION (JP) | 2009-04-16 | — | — | US | disclosed |
| US-20090088535-A1 | METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN | DIC CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |
| US-20090088535-A1 | METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN | DIC CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |