SCHEMBL13878429

SCHEMBL13878429

CNCCC[Si](C)(C)O[Si](C)(C)CCCNC(=O)c1ccc(Oc2ccc(C(C)=O)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ MMP13 P45452 4/20 0.47
▸ RAB9A P51151 3/20 0.47
▸ NPC1 O15118 3/20 0.47
▸ HPGD P15428 4/20 0.46
▸ MAPT P10636 1/20 0.46
▸ ALDH1A1 P00352 1/20 0.43
▸ SMN1; SMN2 Q16637 4/20 0.43
▸ HTT P42858 2/20 0.43
▸ TSHR P16473 1/20 0.43
▸ KMT2A Q03164 2/20 0.43
▸ L3MBTL1 Q9Y468 1/20 0.43
▸ MMP2 P08253 2/20 0.41
▸ CA12 O43570 1/20 0.41
▸ CA1 P00915 1/20 0.41
▸ CA2 P00918 1/20 0.41
▸ CA9 Q16790 1/20 0.41
▸ CYP3A4 P08684 1/20 0.40
▸ STAT3 P40763 1/20 0.40
▸ MAPK14 Q16539 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL258765 0.81 RAB9A (0.55) MMP13RAB9ANPC1HPGDMAPT
SCHEMBL13878432 0.81 SMN1; SMN2 (0.52) RAB9ANPC1HPGDMAPTSMN1; SMN2
SCHEMBL12445333 0.81 HPGD (0.50) MMP13RAB9AHPGDMAPTALDH1A1
SCHEMBL15170741 0.78 NPC1 (0.58) RAB9ANPC1ALDH1A1L3MBTL1CA2
SCHEMBL15237259 0.78 NPC1 (0.58) RAB9ANPC1ALDH1A1L3MBTL1CA2
SCHEMBL15235382 0.78 NPC1 (0.58) RAB9ANPC1ALDH1A1L3MBTL1CA2
SCHEMBL9925387 0.78 NPC1 (0.58) RAB9ANPC1ALDH1A1L3MBTL1CA2
SCHEMBL15235389 0.78 NPC1 (0.58) RAB9ANPC1ALDH1A1L3MBTL1CA2
SCHEMBL13878430 0.78 PGR (0.46) RAB9AMAPTSMN1; SMN2HTTKMT2A
SCHEMBL13878440 0.75 DNMT1 (0.48) MMP13RAB9ANPC1HPGDALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090111050-A1 Novel Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2009-04-30 — — US disclosed
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