SCHEMBL139003

SCHEMBL139003

[N-3].[N-3].[N-3].[N-3].[Ru+4].[Ru+4].[Ru+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9565122 1.00
SCHEMBL1802031 0.82
SCHEMBL2982904 0.82
SCHEMBL570004 0.82
SCHEMBL2454717 0.82
SCHEMBL668727 0.82
SCHEMBL15153822 0.82
SCHEMBL16858619 0.82
SCHEMBL6301067 0.82
SCHEMBL611428 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2327 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112714869-B Nanopore sequencing device including ruthenium-containing electrode 豪夫迈·罗氏有限公司 2024-06-18 CN claimed
CN-114068710-B Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2024-06-18 CN claimed
US-11988625-B2 Capacitive biosensor and fabricating method thereof VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (TW) 2024-05-21 US claimed
US-11971656-B2 Method for manufacturing a membrane assembly ASML NETHERLANDS B.V. (NL) 2024-04-30 US claimed
CN-110998808-B Semiconductor device and method for manufacturing semiconductor device 株式会社半导体能源研究所 2024-04-30 CN claimed
US-11963468-B2 Rram structure TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-04-16 US claimed
CN-117810163-A Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2024-04-02 CN claimed
US-20240103355-A1 REFLECTIVE MASK BLANK, REFLECTIVE MASK AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HOYA CORPORATION (JP) 2024-03-28 US claimed
US-20240105707-A1 Semiconductor Structures And Methods Of Forming The Same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-03-28 US claimed
CN-117615582-A Data storage structure, method of manufacturing the same, and semiconductor device including the same 三星电子株式会社 2024-02-27 CN claimed
EP-0618597-B1 Lightly donor doped electrodes for high-dielectric-constant materials TEXAS INSTRUMENTS INC (US) 1997-07-16 EP claimed
US-5612574-A Semiconductor structures using high-dielectric-constant materials and an adhesion layer TEXAS INSTRUMENTS INCORPORATED (US) 1997-03-18 US claimed
US-5605858-A MINIMIZING THE CRACKS BY SHAPING THE TOP SURFACE TO ROUND CORNER TEXAS INSTRUMENTS INCORPORATED (US) 1997-02-25 US claimed
US-5573979-A Sloped storage node for a 3-D dram cell structure TEXAS INSTRUMENTS INCORPORATED (US) 1996-11-12 US claimed
EP-0726600-A2 Method of forming a structure for DRAM and structure formed thereby TEXAS INSTRUMENTS INCORPORATED (US) 1996-08-14 EP claimed
US-5489548-A FORMING SUPPORTING, ADHESION, UNREACTIVE LAYERS, VAPOR DEPOSITING CONFORMAL LAYER, ANISOTROPICALLY ETCHING CONFORMAL LAYER TO FORM CONDUCTIVE SIDEWALL, DEPOSITING HIGH DIELECTRIC CONSTANT MATERIAL LAYER, FINALLY ELECTRODE TEXAS INSTRUMENTS INCORPORATED (US) 1996-02-06 US claimed
US-5471364-A Multilayer; forming thin dielectric buffer, high dielectric constant and another thin dielectric buffer layers of leakage-curent-density materials; multilayer capacitors TEXAS INSTRUMENTS INCORPORATED (US) 1995-11-28 US claimed
EP-0618598-A1 Improved electrode interface for high-dielectric-constant materials TEXAS INSTRUMENTS INCORPORATED (US) 1994-10-05 EP claimed
EP-0618597-A1 Lightly donor doped electrodes for high-dielectric-constant materials TEXAS INSTRUMENTS INCORPORATED (US) 1994-10-05 EP claimed
EP-0567062-A1 Electrical connections to dielectric materials TEXAS INSTRUMENTS INCORPORATED (US) 1993-10-27 EP claimed