⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL139127 | 1.00 | ALDH1A1 (0.36) | — | |
| Hydrogen Peroxide SCHEMBL4107241 | 0.95 | — | — | |
| Methyl Alcohol SCHEMBL341831 | 0.90 | — | — | |
| SCHEMBL1736341 | 0.89 | ALDH1A1 (0.40) | — | |
| SCHEMBL124190 | 0.89 | — | — | |
| SCHEMBL30 | 0.89 | — | — | |
| Bicarbonate SCHEMBL60768 | 0.88 | FFAR3 (0.44) | — | |
| Methyl Alcohol SCHEMBL946877 | 0.86 | ALDH1A1 (0.35) | — | |
| Methyl Alcohol SCHEMBL6383962 | 0.86 | ALDH1A1 (0.35) | — | |
| Benzene SCHEMBL1394090 | 0.86 | KCNH2 (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| EP-3238238-B1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO KGAA (DE) | 2020-10-28 | — | — | EP | disclosed |
| US-10814042-B2 | Radiopaque polymers for medical devices | ENDOSHAPE, INC. (US) | 2020-10-27 | — | — | US | disclosed |
| EP-3708389-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | Moon, Dae Yong (KR) | 2020-09-16 | — | — | EP | disclosed |
| US-20200262249-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | MUN DAE YONG (KR) | 2020-08-20 | — | — | US | disclosed |
| US-10590218-B2 | Polymer compositions with enhanced radiopacity | ENDOSHAPE, INC. (US) | 2020-03-17 | — | — | US | disclosed |
| US-20200061252-A1 | RADIOPAQUE POLYMERS FOR MEDICAL DEVICES | EMBOLIZATION, INC. | 2020-02-27 | — | — | US | disclosed |
| US-20200054770-A1 | RADIOPAQUE POLYMERS WITH ENHANCED RADIOPACITY | ENDOSHAPE, INC. (US) | 2020-02-20 | — | — | US | disclosed |
| US-10446518-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2019-10-15 | — | — | US | disclosed |
| CN-105073143-A | Radiopaque polymers for medical devices | ENDOSHAPE INC | 2015-11-18 | — | — | CN | disclosed |
| US-9062141-B2 | Radiopaque shape memory polymers for medical devices | ENDOSHAPE, INC. (US) | 2015-06-23 | — | — | US | disclosed |
| US-8950652-B2 | Metal paste with oxidizing agents | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-02-10 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| US-20130225778-A1 | RADIOPAQUE SHAPE MEMORY POLYMERS FOR MEDICAL DEVICES | EMBOLIZATION, INC. | 2013-08-29 | — | — | US | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |
| US-20090253881-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| EP-1882705-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2008-01-30 | — | — | EP | disclosed |