SCHEMBL1394205

SCHEMBL1394205

CO[Si](CCCN(CCC[Si](OC)(OC)OC)CC1CO1)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL141835 0.96
SCHEMBL23521465 0.94 HTT (0.37)
SCHEMBL9776433 0.92 LMNA (0.30)
SCHEMBL139159 0.86 ALDH1A1 (0.30)
SCHEMBL1393421 0.86
SCHEMBL23521512 0.84
SCHEMBL23521504 0.84
SCHEMBL23521519 0.83 SMN1; SMN2 (0.30)
SCHEMBL612373 0.82
SCHEMBL612441 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4619451-A1 MODIFIED POLYMER POLYOLS Repsol, S.A. (ES) 2025-09-24 EP claimed
WO-2024105080-A1 MODIFIED POLYMER POLYOLS REPSOL, S.A. (ES) 2024-05-23 WO claimed
US-20210189053-A1 STABLE MODIFIED POLYMER POLYOL DISPERSIONS REPSOL, S.A. (ES) 2021-06-24 US claimed
EP-3838962-A1 STABLE MODIFIED POLYMER POLYOL DISPERSIONS Repsol, S.A. (ES) 2021-06-23 EP claimed
US-9000086-B2 Thermally curable resin composition for protective film LG CHEM, LTD. (KR) 2015-04-07 US claimed
US-20120010350-A1 THERMALLY CURABLE RESIN COMPOSITION FOR PROTECTIVE FILM LG CHEM, LTD. (KR) 2012-01-12 US claimed
US-5177156-A PROCESS FOR PRODUCING SILANE-MODIFIED POLYPHENYLENE ETHER AND THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-01-05 US claimed
EP-0457351-A2 Process for producing silane-modified polyphenylene ether and thermoplastic resin composition containing the same MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-11-21 EP claimed
EP-4619451-A1 MODIFIED POLYMER POLYOLS Repsol, S.A. (ES) 2025-09-24 EP disclosed
WO-2025073830-A1 STABLE MODIFIED POLYMER POLYOL DISPERSIONS REPSOL, S.A. (ES) 2025-04-10 WO disclosed
US-20240361639-A1 DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE SEKISUI CHEMICAL CO., LTD. (JP) 2024-10-31 US disclosed
CN-113004511-B Stable modified polymer polyol dispersions 雷普索尔有限公司 2024-10-01 CN disclosed
US-12072583-B2 Dimming laminate and resin spacer for dimming laminate SEKISUI CHEMICAL CO., LTD. (JP) 2024-08-27 US disclosed
CN-118215700-A Curable resin composition, cured product, adhesive, and adhesive film 积水化学工业株式会社 2024-06-18 CN disclosed
EP-0606149-A2 Binder composition for mold and method for producing mold KAO CORPORATION (JP) 1994-07-13 EP disclosed
US-5294835-A Including the reaction product of a silane and a phenol aralkyl resin NITTO DENKO CORPORATION (JP) 1994-03-15 US disclosed
US-5177156-A PROCESS FOR PRODUCING SILANE-MODIFIED POLYPHENYLENE ETHER AND THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-01-05 US disclosed
US-5153068-A Discoloration inhibition SEKISUI FINE CHEMICAL CO., LTD. (JP) 1992-10-06 US disclosed
US-5075459-A Organosilicon compound TOSHIBA SILICONE CO., LTD. (JP) 1991-12-24 US disclosed
EP-0457351-A2 Process for producing silane-modified polyphenylene ether and thermoplastic resin composition containing the same MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-11-21 EP disclosed