SCHEMBL139623

SCHEMBL139623

CCC(COC(C)=O)OC

nearest known ligand 0.44

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.44
LMNA P02545 1/20 0.44
HSD17B10 Q99714 1/20 0.44
TDP1 Q9NUW8 1/20 0.41
TSHR P16473 1/20 0.37
ENPP2 Q13822 8/20 0.37
PRKCA P17252 3/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
LPAR6 P43657 3/20 0.36
LPAR1 Q92633 3/20 0.36
LPAR4 Q99677 3/20 0.36
LPAR5 Q9H1C0 3/20 0.36
LPAR2 Q9HBW0 3/20 0.36
LPAR3 Q9UBY5 3/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15081600 0.89 TDP1 (0.38) ALDH1A1LMNAHSD17B10TDP1ENPP2
SCHEMBL25628009 0.88 TDP1 (0.45) ALDH1A1LMNAHSD17B10TDP1ENPP2
SCHEMBL30279850 0.86 ENPP2 (0.33) ALDH1A1LMNAHSD17B10TDP1ENPP2
SCHEMBL1470166 0.84 ALDH1A1 (0.42) ALDH1A1LMNAENPP2CA1CA2
SCHEMBL18124442 0.83 PRKCA (0.40) ALDH1A1LMNAHSD17B10TDP1TSHR
SCHEMBL144017 0.83 TDP1 (0.42) ALDH1A1LMNAHSD17B10TDP1ENPP2
SCHEMBL28749210 0.82 ALDH1A1 (0.53) ALDH1A1LMNAHSD17B10TSHRPRKCA
SCHEMBL425452 0.82 TDP1 (0.50) ALDH1A1LMNAHSD17B10TDP1TSHR
SCHEMBL5192564 0.82 TDP1 (0.50) ALDH1A1LMNAHSD17B10TDP1TSHR
SCHEMBL1470013 0.82 CA1 (0.41) ALDH1A1ENPP2CA1CA2LPAR6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1306 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106697-A1 BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING HUSTAD PHILLIP DENE (US) 2025-05-22 WO claimed
WO-2025106703-A1 BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING HUSTAD PHILLIP DENE (US) 2025-05-22 WO claimed
US-11822250-B2 Solution, method of forming resist pattern, and semiconductor device manufacturing method TOKYO OHKA KOGYO CO., LTD. (JP) 2023-11-21 US claimed
US-11488824-B2 Method for manufacturing semiconductor device using silicon-containing resist underlayer film forming composition for solvent development NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2022-11-01 US claimed
CN-114539524-A Photosensitive resin precursor polymer, photosensitive resin composition paste and use thereof 吉林奥来德光电材料股份有限公司 2022-05-27 CN claimed
CN-104914672-B Bottom anti-reflection composition based on molecular glass containing polyhydroxy structure and application thereof 中国科学院化学研究所 2020-08-21 CN claimed
CN-104914672-A Bottom anti-reflection coating composition based on molecule glass comprising multiple hydroxy structures and application thereof to photoetching CHINESE ACAD INST CHEMISTRY 2015-09-16 CN claimed
US-20090181218-A1 Conductive pattern and method of forming thereof LG CHEM, LTD. (KR) 2009-07-16 US claimed
US-5738975-A MIXTURE CONTAINING (METH)ACRYLATE TERPOLYMER HAVING GROUP WHICH REACTS WITH AN ACID TO CONVERT POLARITY OF POLYMER, PHOTO ACID GENERATING COMPOUND, SOLVENT NEC CORPORATION (JP) 1998-04-14 US claimed
CN-122095069-A Washing liquid and washing method 2026-05-26 CN disclosed
CN-122095070-A Washing liquid and washing method 2026-05-26 CN disclosed
EP-4745668-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2026-05-20 EP disclosed
EP-4743828-A1 PHOTOCURABLE AS WELL AS THERMALLY CURABLE COMPOSITIONS SUITABLE FOR LOW TEMPERATURE CURING BASF SE (DE) 2026-05-20 EP disclosed
US-12631963-B2 Method for producing hollow package and method for providing photosensitive composition TOKYO OHKA KOGYO CO., LTD. (JP) 2026-05-19 US disclosed
US-5585507-A FINENESS PATTERNS NEC CORPORATION (JP) 1996-12-17 US disclosed
EP-0741332-A1 Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORPORATION (JP) 1996-11-06 EP disclosed
EP-0720053-A2 Photosensitive resin composition, photosensitive printing plate and method of manufacturing printing master plate TOKYO OHKA KOGYO CO., LTD. (JP) 1996-07-03 EP disclosed
US-5242782-A Flexographic printing plate ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-09-07 US disclosed
US-5128234-A PRODUCTION OF PHOTOPOLYMERIC FLEXOGRAPHIC RELIEF PRINTING PLATES BASF AKTIENGESELLSCHAFT (DE) 1992-07-07 US disclosed
EP-0439123-A2 A method for producing a photocured image structure Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-07-31 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12631963-B2 Method for producing hollow package and method for providing photosensitive composition ASH2L, AS3MT, ASH1L ALDH1A1 2680/4885LMNA 3028/4885HSD17B10 4748/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.