SCHEMBL140242

SCHEMBL140242

CC(c1ccc(OC#N)cc1)(c1ccc(OC#N)cc1)c1ccc(OC#N)cc1

nearest known ligand 0.35

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.35
ESR2 Q92731 2/20 0.35
ALDH1A1 P00352 2/20 0.33
HPGD P15428 2/20 0.33
NPC1 O15118 1/20 0.33
MAPT P10636 1/20 0.33
MAPK1 P28482 1/20 0.33
RAB9A P51151 1/20 0.33
KIF11 P52732 1/20 0.33
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31
CYP19A1 P11511 1/20 0.31
LMNA P02545 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
KDM4E B2RXH2 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28080725 0.94 RAB9A (0.42) ESR1ESR2ALDH1A1HPGDNPC1
SCHEMBL15348274 0.92 ESR1 (0.48) ESR1ESR2ALDH1A1MAPTMAPK1
SCHEMBL8909928 0.86 ALDH1A1 (0.33) ALDH1A1HPGDNPC1MAPTMAPK1
SCHEMBL7789786 0.86 HPGD (0.41) ESR1ESR2ALDH1A1HPGDNPC1
SCHEMBL25961 0.86 HPGD (0.41) ESR1ESR2ALDH1A1HPGDNPC1
SCHEMBL6720151 0.86 MAPT (0.47) ALDH1A1HPGDNPC1MAPTMAPK1
SCHEMBL1555244 0.86 HPGD (0.41) ESR1ESR2ALDH1A1HPGDNPC1
SCHEMBL4266064 0.86 ESR1 (0.34) ESR1ESR2
SCHEMBL25873141 0.83 CYP3A4 (0.37) MAPK1
SCHEMBL24982029 0.83 NPC1 (0.31) ALDH1A1HPGDNPC1MAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 467 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4466319-A1 HIGH PERFORMANCE THERMOSET RESINS FOR 3D PRINTING Noga 3D Innovations Ltd (IL) 2024-11-27 EP claimed
WO-2023139579-A1 HIGH PERFORMANCE THERMOSET RESINS FOR 3D PRINTING NOGA 3D INNOVATIONS LTD (IL) 2023-07-27 WO claimed
EP-3344676-B1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON INC (US) 2023-04-12 EP claimed
CN-111087809-B Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2022-09-13 CN claimed
US-10920008-B2 Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-02-16 US claimed
US-20200123307-A1 THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-04-23 US claimed
US-10471655-B2 Cyanate ester dual resins for additive manufacturing CARBON, INC. (US) 2019-11-12 US claimed
US-20190010343-A1 CYANATE ESTER DUAL RESINS FOR ADDITIVE MANUFACTURING CARBON3D INC (US) 2019-01-10 US claimed
EP-3344676-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2018-07-11 EP claimed
US-20170173866-A1 PRODUCTION OF INJECTION MOLDS BY ADDITIVE MANUFACTURING WITH DUAL CURE RESINS CARBON INC (US) 2017-06-22 US claimed
WO-2017040883-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2017-03-09 WO claimed
EP-0252661-B1 BLENDS OF TRIS(CYANATOPHENYL) ALKANES AND BIS(CYANATOPHENYL) ALKANES Interez, Inc. (a Georgia corporation) (US) 1992-02-12 EP claimed
EP-3438146-B1 CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2026-04-08 EP disclosed
EP-4698582-A1 CURABLE ORGANOSILOXANE-MODIFIED REACTION RESINS Wacker Chemie AG (DE) 2026-02-25 EP disclosed
US-12534617-B2 Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-27 US disclosed
US-12486371-B2 Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-12-02 US disclosed
WO-1996039457-A1 AROMATIC CYANATE ESTER SILANE COUPLING AGENTS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-12-12 WO disclosed
WO-1996035760-A1 BLEED RESISTANT CYANATE ESTER-CONTAINING COMPOSITIONS QUANTUM MATERIALS, INC. (US) 1996-11-14 WO disclosed
WO-1996027628-A1 ENERGY-POLYMERIZABLE COMPOSITIONS COMPRISING A CYANATE ESTER MONOMER OR OLIGOMER AND A POLYOL MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-09-12 WO disclosed
WO-1994029368-A1 ENERGY-CURABLE CYANATE/ETHYLENICALLY UNSATURATED COMPOSITIONS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-12-22 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12534617-B2 Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board CHRM1, MRPL37, MRPL38 ESR1 346/4885ESR2 1932/4885ALDH1A1 3075/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.