SCHEMBL1406014

SCHEMBL1406014

CCC/C=C/C[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1406016 1.00
SCHEMBL31351402 0.86 LPAR3 (0.40)
SCHEMBL28464257 0.84 FAAH (0.45)
SCHEMBL388165 0.84
SCHEMBL388164 0.84
SCHEMBL28668663 0.82 FAAH (0.48)
SCHEMBL23668464 0.80
SCHEMBL31351387 0.80 LMNA (0.36)
SCHEMBL17918207 0.80
SCHEMBL31351414 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025023143-A1 GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH 信越化学工業株式会社 2025-01-30 WO disclosed
EP-1696000-B2 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2014-10-15 EP disclosed
US-20110189476-A1 ORGANIZED CLAY COMPOSITE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY COMPOSITE SHOWA DENKO K.K. (JP) 2011-08-04 US disclosed
EP-1696000-B1 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2011-03-09 EP disclosed
US-20100190908-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY SHOWA DENKO K.K. (JP) 2010-07-29 US disclosed
EP-2186776-A1 ORGANIZED CLAY COMPLEX, METHOD FOR PRODUCING THE SAME, AND RESIN COMPLEX CONTAINING ORGANIZED CLAY COMPLEX Showa Denko K.K. (JP) 2010-05-19 EP disclosed
EP-1420049-B1 SURFACE-TREATED INORGANIC PARTICLES KANEKA CORP (JP) 2010-04-21 EP disclosed
EP-2172425-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY Showa Dendo K.K. (JP) 2010-04-07 EP disclosed
US-20080193736-A1 Resin-impregnated porous filler AKEBONO BRAKE INDUSTRY CO., LTD. (JP) 2008-08-14 US disclosed
US-20080167413-A1 Organic-inorganic composite composition, plastic substrate, gas barrier laminate film, and image display device NISHIMI TAISEI 2008-07-10 US disclosed
US-20080064824-A1 Polyester Resin Composition and Molded Object KANEKA CORPORATION (JP) 2008-03-13 US disclosed
EP-1696000-A1 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORPORATION (JP) 2006-08-30 EP disclosed
US-20050214556-A1 Organic-inorganic composite composition, plastic substrate, gas barrier laminate film, and image display device FUJI PHOTO FILM CO., LTD (JP) 2005-09-29 US disclosed
US-20040197561-A1 Process for producing surface-treated inorganic particle and surface-treated inogranic particle KANEKA CORPORATION (JP) 2004-10-07 US disclosed
EP-1026203-B1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORP (JP) 2004-09-08 EP disclosed
EP-1420049-A1 PROCESS FOR PRODUCING SURFACE&amp;minus;TREATED INORGANIC PARTICLE AND SURFACE&amp;minus;TREATED INORGANIC PARTICLE KANEKA CORPORATION (JP) 2004-05-19 EP disclosed
US-6583208-B1 Dispersion with organosilane-treated phyllosilicate KANEKA CORPORATION (JP) 2003-06-24 US disclosed
EP-1026203-A1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORPORATION (JP) 2000-08-09 EP disclosed