SCHEMBL1406016

SCHEMBL1406016

CCCC=CC[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1406014 1.00
SCHEMBL31351402 0.86 LPAR3 (0.40)
SCHEMBL28464257 0.84 FAAH (0.45)
SCHEMBL388165 0.84
SCHEMBL388164 0.84
SCHEMBL28668663 0.82 FAAH (0.48)
SCHEMBL23668464 0.80
SCHEMBL31351387 0.80 LMNA (0.36)
SCHEMBL17918207 0.80
SCHEMBL31351414 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025023143-A1 GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH 信越化学工業株式会社 2025-01-30 WO disclosed
EP-1696000-B2 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2014-10-15 EP disclosed
US-20110189476-A1 ORGANIZED CLAY COMPOSITE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY COMPOSITE SHOWA DENKO K.K. (JP) 2011-08-04 US disclosed
EP-1696000-B1 POLYESTER RESIN COMPOSITION AND MOLDED OBJECT KANEKA CORP (JP) 2011-03-09 EP disclosed
US-20100190908-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY SHOWA DENKO K.K. (JP) 2010-07-29 US disclosed
EP-2186776-A1 ORGANIZED CLAY COMPLEX, METHOD FOR PRODUCING THE SAME, AND RESIN COMPLEX CONTAINING ORGANIZED CLAY COMPLEX Showa Denko K.K. (JP) 2010-05-19 EP disclosed
CN-101711224-A Organized clay, process for producing the same, and resin composite containing organized clay SHOWA DENKO KK 2010-05-19 CN disclosed
EP-1420049-B1 SURFACE-TREATED INORGANIC PARTICLES KANEKA CORP (JP) 2010-04-21 EP disclosed
EP-2172425-A1 ORGANIZED CLAY, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITE CONTAINING ORGANIZED CLAY Showa Dendo K.K. (JP) 2010-04-07 EP disclosed
CN-101687655-A Organized clay complex, method for producing the same, and resin complex containing organized clay complex SHOWA DENKO KK 2010-03-31 CN disclosed
US-20050214556-A1 Organic-inorganic composite composition, plastic substrate, gas barrier laminate film, and image display device FUJI PHOTO FILM CO., LTD (JP) 2005-09-29 US disclosed
EP-0899308-B1 THERMOPLASTIC RESIN COMPOSITION CONTAINING SILANE-TREATED FOLIATED PHYLLOSILICATE AND METHOD FOR PRODUCING THE SAME KANEKA CORP (JP) 2004-11-03 EP disclosed
US-20040197561-A1 Process for producing surface-treated inorganic particle and surface-treated inogranic particle KANEKA CORPORATION (JP) 2004-10-07 US disclosed
EP-1026203-B1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORP (JP) 2004-09-08 EP disclosed
EP-1420049-A1 PROCESS FOR PRODUCING SURFACE&amp;minus;TREATED INORGANIC PARTICLE AND SURFACE&amp;minus;TREATED INORGANIC PARTICLE KANEKA CORPORATION (JP) 2004-05-19 EP disclosed
US-6583208-B1 Dispersion with organosilane-treated phyllosilicate KANEKA CORPORATION (JP) 2003-06-24 US disclosed
EP-1142954-A1 RESIN COMPOSITIONS AND PROCESS FOR PRODUCING THE SAME Kaneka Corporation (JP) 2001-10-10 EP disclosed
US-6239195-B1 INTRODUCING THE ORGANOSILANE COMPOUND INTO THE SWELLABLE LAYERED SILICATE AFTER THE BASAL SPACING OF THE SWELLABLE LAYERED SILICATE HAS BEEN EXPANDED, AND IS EXFOLIATED AS A NUMBER OF FINE LAYERS DISPERSED UNIFORMLY KANEKA CORPORATION (JP) 2001-05-29 US disclosed
EP-1026203-A1 POLYESTER RESIN COMPOSITIONS AND PROCESSES FOR THE PREPARATION THEREOF KANEKA CORPORATION (JP) 2000-08-09 EP disclosed
EP-0899308-A1 THERMOPLASTIC RESIN COMPOSITION CONTAINING CLAY COMPOSITE AND PROCESS FOR PREPARING THE SAME KANEKA CORPORATION (JP) 1999-03-03 EP disclosed