SCHEMBL14130421

SCHEMBL14130421

COc1ccc(/N=N/c2ccc(OC(=O)c3ccc(C(=O)Oc4ccc(/N=N/c5ccc(OC)cc5)cc4)cc3)cc2)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRSS1 P07477 7/20 0.71
ACR P10323 6/20 0.71
KMT2A Q03164 3/20 0.62
MAPT P10636 2/20 0.62
GFER P55789 1/20 0.62
LMNA P02545 1/20 0.62
CYP1A2 P05177 1/20 0.62
CYP2C9 P11712 1/20 0.62
CYP2C19 P33261 1/20 0.62
SMN1; SMN2 Q16637 1/20 0.62
CA1 P00915 1/20 0.58
CA2 P00918 1/20 0.58
HGFAC Q04756 2/20 0.58
F2 P00734 3/20 0.57
PRSS2 P07478 3/20 0.57
PRSS3 P35030 3/20 0.57
CASP3 P42574 1/20 0.54
RAB9A P51151 1/20 0.54
SENP8 Q96LD8 1/20 0.54
SENP7 Q9BQF6 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14130077 0.91 ACR (0.60) PRSS1ACRKMT2AMAPTGFER
SCHEMBL12633724 0.89 LMNA (0.75) PRSS1ACRKMT2AMAPTGFER
SCHEMBL12608584 0.89 LMNA (0.75) PRSS1ACRKMT2AMAPTGFER
SCHEMBL7591660 0.89 LMNA (0.75) PRSS1ACRKMT2AMAPTGFER
SCHEMBL9666088 0.89 LMNA (0.75) PRSS1ACRKMT2AMAPTGFER
SCHEMBL27489618 0.87 HGFAC (0.66) PRSS1ACRKMT2AMAPTGFER
SCHEMBL14130414 0.87 ACR (0.56) PRSS1ACRKMT2AMAPTGFER
SCHEMBL22328173 0.86 ACR (0.56) PRSS1ACRKMT2AMAPTGFER
SCHEMBL21396265 0.86 PRSS1 (0.71) PRSS1ACRKMT2AMAPTSMN1; SMN2
SCHEMBL21185827 0.86 PRSS1 (0.71) PRSS1ACRKMT2AMAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080161532-A1 COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-07-03 US disclosed
US-20080161532-A1 COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-07-03 US disclosed