SCHEMBL14188917

SCHEMBL14188917

CC(C)(c1ccc(OC2=CCCC=C2)cc1)c1ccc(Oc2ccccc2)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.38
MEN1 O00255 5/20 0.38
SMN1; SMN2 Q16637 1/20 0.37
LTA4H P09960 5/20 0.37
TSHR P16473 1/20 0.35
ALDH1A1 P00352 4/20 0.35
ESR1 P03372 1/20 0.35
CYP3A4 P08684 1/20 0.35
ESR2 Q92731 1/20 0.35
NPC1 O15118 3/20 0.33
RAB9A P51151 3/20 0.33
MAPT P10636 1/20 0.33
HPGD P15428 1/20 0.33
MAPK1 P28482 1/20 0.33
NR1H2 P55055 1/20 0.33
BAX Q07812 1/20 0.33
MAOA P21397 1/20 0.33
KDM4E B2RXH2 2/20 0.33
POLB P06746 2/20 0.33
LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21540141 0.87 LTA4H (0.46) LTA4HTSHRNR1H2BAXMAOA
SCHEMBL10273562 0.84 LTA4H (0.44) KMT2ALTA4HTSHRMAPTNR1H2
SCHEMBL19346893 0.83 RAB9A (0.46) KMT2AMEN1SMN1; SMN2TSHRALDH1A1
SCHEMBL2463038 0.79 LTA4H (0.57) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL9248118 0.77 ALDH1A1 (0.56) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL11226988 0.75 ALDH1A1 (0.58) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL10760022 0.75 ALDH1A1 (0.58) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL15308162 0.72 SMN1; SMN2 (0.55) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL12868821 0.72 LTA4H (0.72) KMT2AMEN1SMN1; SMN2LTA4HTSHR
SCHEMBL12153390 0.71 ALDH1A1 (0.48) KMT2AMEN1SMN1; SMN2LTA4HTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008069805-A1 PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER HENKEL AG & CO. KGAA (DE) 2008-06-12 WO disclosed
WO-2008060280-A1 BOARD ON CHIP PACKAGE AND PROCESS FOR MAKING SAME HENKEL AG & CO. KGAA (DE) 2008-05-22 WO disclosed